RS Components is now shipping FTDI’s latest USB 3.0-to-FIFO solutions, including ICs and development boards, for projects that demand SuperSpeed data transfer.
The FT600Q and FT601Q USB-to-FIFO bridge ICs enable USB 3.0 SuperSpeed and USB 2.0 High Speed data exchange with high-performing devices such as multi-function printers, high-speed/high-resolution video cameras, medical and industrial imaging systems, still image cameras, high-definition displays, surveillance systems and scanners. Data-acquisition systems can use the devices to take advantage of USB 3.0 as an alternative to Ethernet for high-speed, high-volume data transfers.
Designers can choose the FT600Q with 16-bit FIFO interface in a low pin-count 56-pin QFN package, or the FT601Q with 32-bit interface in 76-pin QFN. Both devices can have up to eight endpoints, and support simple 245 FIFO interfacing or multi-channel FIFO mode for data burst rates of up to 3,2 Gbps. Other features include configurable GPIOs, multi-voltage (1,8 V/ 2,5 V/ 3,3 V) I/O, and 100 MHz or optional 66,7 MHz FIFO clock. In addition, Link Power Management (LPM), remote-wakeup signalling, and battery charger detection help maximise mobile battery life.
Initially four development boards are available, which are designed to connect to a companion FPGA board. A choice of ANSI/VITA FMC (FPGA Mezzanine Card) or Altera HSMC (High-Speed Mezzanine Card) connectors, with either the FT600Q or FT601Q IC, allow developers to select a target device and development platform from their preferred FPGA vendor. The boards can be configured to accept power from the USB VBUS, the FIFO master board, or an external DC adaptor. Windows drivers for the new ICs are available immediately, and Linux and MAC support will be added soon.
Wi-Fi 6/BLE module enables rapid development Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the WE310K6, a fully integrated, low-power module featuring dual-band, dual-stream Wi-Fi 6, and dual-mode Bluetooth/BLE.
Read more...Low phase noise amplifier RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
The MAAL-011158 from Macom is an easy-to-use low-phase noise amplifier that provides 12 dB of gain in a 32-lead QFN plastic package.
Read more...Full sensor to cloud solution CST Electronics
Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.
Read more...Long-range Wi-Fi HaLow module TRX Electronics
Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.
Read more...Quectel launches 3GPP NTN comms module Quectel Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.
Read more...SIMCom’s A7673x series Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.
Read more...TDK expands MLCC series RS South Africa
Passive Components
TDK Corporation has expanded its CGA series of multilayer ceramic capacitors, currently being the highest capacitance in 100 V products for automotive applications.