4 November 2015Manufacturing / Production Technology, Hardware & Services
Soldering is the primary interconnection technology for area array packages. Methods for solder bumping for area array packages can be categorised as follows: (1) buildup process, (2) liquid solder transfer, (3) solid solder transfer, and (4) solder paste bumping.
The first group includes both evaporation and electroplating processes, while the second group includes meniscus bumping and solder jetting. The third group includes wire bumping, sphere welding, decal solder transfer, tacky dot solder transfer, integrated preform, and pick-and-place solder transfer processes, with the latter being the currently prevailing option. Solder paste bumping exhibits great potential to reduce bumping costs dramatically, and includes the print-detach-reflow, print-reflow- detach, and dispense approaches.
For an area array package attachment process, depending on the type of packaging, either flux, fluxless soldering or solder paste printing may be used as the attachment medium. Although area array packaging generally offers a robust process, attention should be paid to reduce defects such as delamination, misalignment, elongated joint, voiding, bridging, opens, cracking, poor wetting and various attachment interactions.
To read a comprehensive and detailed white paper exploring these topics, authored by Indium’s Ning-Cheng Lee and Micron Technology’s William Casey, visit www.dataweek.co.za/+k2939.
20 years of precision, progress and purpose – the Jemstech journey Jemstech
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Twenty years ago, Jemstech began as a small, determined venture built on technical excellence and trust. Today, it stands among South Africa’s leading electronic manufacturing service providers.
Read more...An argument to redefine IPC class definitions for class 1, 2, & 3 electronics MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
One of the most critical aspects of electronic assembly reliability is cleanliness. Contaminants left on a circuit board after the reflow process can lead to failures through mechanisms such as electrochemical migration or corrosion.
Read more...Large platform stencil printer Techmet
Manufacturing / Production Technology, Hardware & Services
GKG’s large platform stencil printer, the P-Primo, is designed to meet customer’s ultra-large printing requirements by supporting board dimensions up to 850 x 610 mm.
Read more...Press-fit component inspection MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
In electronics manufacturing, optical inspection of press-fit components is crucial to ensure the quality, reliability, and performance of the final assembled product.
Read more...A new era in wire bond inspection Techmet
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Viscom is developing a 3D wire bond inspection system that incorporates substantially improved sensors, a high image resolution, and fast image data processing.
Read more...Mycronic’s MYPro A40 pick-and-place solution MyKay Tronics
Manufacturing / Production Technology, Hardware & Services
Mycronic’s MYPro A40 pick-and-place solution, equipped with an MX7 high-speed mounthead technology, increases top placement speeds by 48% over the previous generation.
Read more...Why ergonomics matters in digital microscopy TANDM
Manufacturing / Production Technology, Hardware & Services
While magnification technology has kept pace with demand, the wellbeing of the people behind the microscopes has often been overlooked with technicians spending long hours in intense focus, leading to chronic strain, fatigue, and costly mistakes.
Read more...From ER to effortless: The 15-year journey of Seven Labs Technology Seven Labs Technology
Editor's Choice Manufacturing / Production Technology, Hardware & Services
What started as a business likened to an ‘ER’ for electronic components has today grown into a trusted partner delivering kitting services and full turnkey solutions – taking the effort out of electronics and helping customers truly ‘Move to Effortless.’
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version