25 November 2015
Telecoms, Datacoms, Wireless, IoT
Design Automation
FTDI Chip has added to the support it can offer to engineers using its X-Chip series by introducing an array of new breakout boards. Through these compact, low-profile boards, the bridging of USB 2.0 (Full Speed) signals to serial or parallel interfaces is facilitated.
The UMFT200XD is a USB-to-I²C module with four control bus lines, which is based on the FT200XD device. The UMFT201XB incorporates an FT201XQ IC and is also designed for USB-to-I²C conversion. This is complemented by the UMFT220XB, featuring a FT220XQ, which enables conversion of USB to a user-chosen, parallel bit interface (FTDI Chip’s own proprietary FT1248 I/O) where the data bus may be set to a bit width of 1, 2, 4 or 8 depending on design constraints.
The UMFT230XB module relies on a FT230XQ USB-to-UART IC, has 4 control bus lines and can be utilised for UART bridging with a UART rate of 3 Mbps available. These modules are powered via USB, with no additional power source required. They do not have a built-in USB connector as the mechanical dimensions of the PCB allow direct insertion into the USB host connector.
In addition to the standard ‘-01’ products, the breakout boards are offered in two other versions: the ‘-NC’ variant is supplied without the connector on the I/O side, while the ‘-WE’ variant comes with 15 cm flying leads attached. Each of these boards is suitable for use with a broad range of different operating systems, includingWindows CE.NET/Vista/7/8/XP/XP Embedded, as well as Android, Linux 3.0 (and above) and MAC OS-X.
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