Designed to terminate to FFC, FPC and FEC type cable, TE Connectivity’s family of flat flexible cable (FFC) connectors includes a wide variety of high density cable-to-board and cable-to-cable connectors specifically for automated assembly. These products are available in 2,54 mm and 1,27 mm centreline contact spacing.
Receptacle housings not only mate with pin housings, but also with an array of printed circuit board headers from other TE connector lines, including AMPMODU connectors and AMP-LATCH headers. TE’s unique crimp design makes more reliable and gas-tight connections while fully programmable application tooling allows for easy termination.
4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
Read more...56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
Read more...Space SMPM and SMPM-Lock connectors Hiconnex
Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.
Read more...Space saving SMD common-mode chokes Electrocomp
Passive Components
TDK Corporation presents the EP21 series of flat-wire double chokes designed for common-mode EMI filtering and available in an SMD format with dimensions of only 23,8 x 17,7 mm and heights ranging from 21,6 to 22,3 mm
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...Samtec supports SGeT oHFM.c with high-performance interconnects Spectrum Concepts
Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
Read more...Connectivity solutions for hydrogen technologies Hiconnex
Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.
Read more...DC-link capacitors with ultra-low inductance Electrocomp
Passive Components
TDK Corporation recently released its new series of MKP DC high-frequency film capacitors, a high-performance DC link capacitor platform for next-generation SiC-based power electronics.
Read more...Mixed-density Combo-D connectors Hiconnex
Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.
Read more...Same Sky expands rectangular connector portfolio Future Electronics
Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.
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