NXP plans slew of MCUs for 2017 release - 31 January 2017 - EBV Electrolink

NXP plans slew of MCUs for 2017 release
31 January 2017, DSP, Micros & Memory

NXP Semiconductors revealed plans for an extensive pipeline of microcontrollers (MCUs) to be rolled out during 2017. The new ARM Cortex-M based devices slated for release this year include a roadmap of LPC800 and LPC54000 series additions, in addition to the brand new LPC546xx family.

The LPC800 series is an entry-level range designed as a 32-bit alternative to 8-bit MCUs, providing a familiar form factor for easy migration from 8-bit design and a path to lower prices. Its feature set includes the following: the flexibility of NXP’s switch matrix that allows any peripheral to be paired with any pin without restrictions; GPIO interrupt generation capability with Boolean pattern matching capability; flexible PWM/timer that allows users to program functions to meet the needs of the application; and direct memory access (DMA) with a comprehensive set of serial interfaces and analog integration.

The LPC54000 series takes the best of the ARM Cortex-M3 based LPC1768, refining its features to deliver a balance of performance and scalability. This Cortex-M4 based MCU series offers state-of-the-art power efficiency and extreme design flexibility with its communication interfaces, accurate low-power internal oscillator and a 5 MSps analog-to-digital converter.

Finally, representing the first of five new LPC product introductions planned for this year, the LPC546xx family is tailored to meet the requirements of various consumer and industrial applications, from the automotive aftermarket to industrial control panels, connected smart home appliances, data concentrators and communication hubs.

LPC546xx MCUs will feature a wide dynamic range for performance scalability from very low frequencies to 180 MHz. This allows a user to optimise an application’s power consumption by completing complex tasks faster. It will also incorporate a Quad SPI Flash interface with replacement policy buffers that allows execution in place, as well as peripherals optimised for audio applications, supporting PDM-to-PCM conversion for voice recognition and fractional PLL for USB audio bridging.

Additional features of the LPC546xx range are an external memory bus; dual CAN FD controllers; integrated 1024x768 graphics display controller; and 21 communication interfaces and advanced integration, including Ethernet/cloud connectivity, full-speed and high-speed USB with integrated physical transceiver, SDIO and smart card interface.

The LPC546xx MCU family is scheduled for mass production with full market availability in March 2017. The additional LPC54000 and LPC800 microcontrollers are expected to release in the second, third and fourth quarters of 2017.

For more information contact EBV Electrolink, +27 (0)21 402 1940, capetown@ebv.com, www.ebv.com