Interconnection


Low profile wire-to-board connectors

19 April 2017 Interconnection

Hirose has introduced the DF58 series to deliver a space-saving, low profile, wire-to-board connectivity solution for miniature applications. The connector range consists of crimp sockets and headers in a single row, with a minimal mated height profile of 1,0 mm and depth of 4,97 mm to reduce the space needed on the board. A long effective mating length of 0,29 mm is achieved despite the low profile mated height.

Although the connector is miniature in size the power rating is not comprised. A high current rating capability of 3 A (using the two-contact version with #28 AWG cable) can be achieved to support power supply applications. Highly reliable two-point clipping contacts are utilised to stabilise contact resistance and reduce temperature rise.

Secure connection is guaranteed with the ViSe (Vertical-insertion Swing-extraction) double-locking mechanism. The crimp socket is mated to the header in a vertical direction, however it is guided in at an angle to engage with the positive lock. This ensures high retention force in the upper direction and prevents the cables from being disconnected easily. The friction lock prevents incomplete locking and floating after mating.

A wide range of applications are suitable such as wearable devices, service robots, drones, medical devices, point-of-sale equipment, digital cameras and many other small portable devices.

For more information contact Barry Culligan, Otto Marketing, +27 (0)11 791 1033, contact@otto.co.za, www.otto.co.za



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