11 October 2017Manufacturing / Production Technology, Hardware & Services
The all new MY700 high-speed jet dispenser, for jet printing of solder paste and dispensing of assembly fluids, is the first release in Mycronic’s next-generation MYPro series product lineup. As part of the new high-productivity MYPro series, the MY700 will process any type of circuit board, from standard to complex flexible boards, by jetting high-speed, high-precision solder paste and assembly fluid deposits.
High-mix and higher volume SMT manufacturers continue to face growing product mixes and challenging boards, together with a wider variety of miniaturised components and adhesive fluid applications. The new machine’s dual-head design covers the widest possible range of solder paste dot volumes for small and very large components, or can be configured to jet two different types of media including solder paste and adhesive. Its dual-lane capabilities ensure a non-stop flow of multiple boards, amounting to faster cycle times with no operator intervention.
With just one fully software-driven machine, the MY700 makes it possible to combine an array of challenging process steps with no need for screen printers or general dispensers, all within just one-and-a-half square metres of floor space – a reduction of 30% from previous machine generations. Advanced automation features include automatic job selection from barcode, fiducial recognition on-the-fly, fast scanning of bar codes for traceability, automatic board stretch compensation as well as laser height measurement for board warpage compensation.
The MY700 will be available in three different models:
MY700JX is an all-in-one solution for solder paste and adhesive jetting.
In complex, mixed production environments, it can eliminate the need for both screen printers and glue dispensers. Dual heads allow manufacturers to combine solder paste jet printing with high-speed jet dispensing of a wide range of approved fluids such as adhesives, UV materials and epoxies.
MY700JP is designed for high-precision solder paste jetting of any deposit volume. It provides complete control over solder paste deposit volume, shape and position, making it ideal for challenging applications such as pin-in-paste, package-on-package, flexible substrates and board cavities.
MY700JD is all about speed. Thanks to its advanced motion systems, it ensures significantly higher throughput rates for all kinds of selective coating, capillary underfill and encapsulation applications, as well as for complex SMA and random dot patterns.
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