1 January 2018
Manufacturing / Production Technology, Hardware & Services
Mek’s (Marantz Electronics) latest automated solder paste inspection (SPI) system, the ISO-Spector S2, features patented third generation sensor technology that enables unique, simultaneous 2D and 3D inspection.
The machine utilises the latest in 12 megapixel camera technology, and a fibre-optic link allows for a 32 gigabit per second image data transfer speed. It delivers the highest-quality 2D colour imaging using Episcopic and low-angle diffuse RGB lighting systems that remove all specular reflections from solder fluxes and solder mask. Shadow free violet/blue dual lasers provide precise and repeatable 3D images.
The system is available with standard 18/9 µm lens resolution for inspection down to 01005 pad geometries or optionally with 12/6 μm for pad geometries down to 008004. On-the-fly resolution switching allows the efficient inspection of mixed technology PCBs. Synthetic colour imaging allows the simplification of colour extraction of solder mask, silk screen and solder, and isolates the solder to be measured, even below zero reference.
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