21 February 2018
Manufacturing / Production Technology, Hardware & Services
In the world of complex RF/microwave printed circuit boards (PCB), where SWaP (size, weight and power) are critical to future performance, thermal management and the ability to keep modules and systems efficient is becoming an increasing problem.
In response, RF/microwave GaN (gallium nitride) amplifiers are becoming more efficient and are now available as SMT devices. The key to having an efficient amplifier is ensuring the presence of a good ground plane beneath the device, and the ability to manage the excess heat that is generated. One of the best ways of achieving this is to use thermal ground vias directly below the amplifier. The size and volume of each plated through-via can be calculated to give the most efficient method of thermal control.
Teledyne Labtech has developed a method whereby it can fill all the ground plated through-via holes with copper and then over-plate the hole. This gives a perfectly flat finish and has the added benefit of ensuring that the vias are filled and thereby reducing the risk of air voids beneath the surface mount components.
Should the filled via not offer sufficient thermal management, Teledyne Labtech can offer a copper coin PCB, metal-cored PCB and metal-backed PCB. The edges of the PCB can then be exposed and used as a ‘cold rail’ and clamped to the chassis. Where PCBs require large BGA or LSI devices, again filled, plated through-vias are perfect for via-in-pad requirements.
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