Supercomputing students bring home third prize
18 July 2018
Editor's Choice
News
The South African supercomputing team that participated in the International Student Cluster Competition in Frankfurt, Germany, took third place behind China’s Tsinghua University and Nanyang Technological University of Singapore.
The team of six, made up of undergraduate computer science and engineering students from the Universities of the Witwatersrand and Limpopo, was one of 12 teams from around the world that participated in the prestigious challenge from 25 to 27 June 2018.
The students showcased computing systems of their own design, adhering to strict power constraints and seeking to achieve the highest performance across a series of standard high-performance computing benchmarks and applications. South Africa has been participating in the international competition since 2013 and won it in 2013, 2014 and 2016, coming second in 2015 and 2017. It is one of the few teams that consists entirely of undergraduate students, and that sends different students each year.
Before participating, the members of the team received extensive training from the Centre for High Performance Computing (CHPC), an initiative of the Department of Science and Technology and the Council for Scientific and Industrial Research (CSIR).
The CHPC’s Director, Dr Happy Sithole, said that the placing was “a significant achievement for South Africa,” and that the CHPC hopes to increase the number of students who received exposure of this kind in the field of high-performance computing. “In the past six years we have had 36 students performing well on the world stage,” he said.
The South African team was chosen from 10 participating teams at a national student cluster supercomputing competition held in December last year. Team selection for the national competition takes place at the CHPC’s Winter School, which is designed to impart critical knowledge for building a cluster. This includes using Linux systems, the basic software stack of a cluster, and considerations that should be taken into account when choosing hardware. Team selection concludes with an assignment that requires each team to build a prototype cluster in the cloud.
After all their hard work, this year’s team – Meir Rosendorff, Joshua Bruton, Kimessha Paupamah, Katleho Mokoena, Nathan Michlo and Njabulo Sithole – said that they planned to hire bicycles and cycle around Frankfurt “doing touristy things”.
For more information contact Nox Moyake, CHPC, [email protected]
Further reading:
What is Wi-Fi HaLow and why choose it for IoT?
iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Wi-Fi HaLow introduces a low power connectivity option that, in contrast to other Wi-Fi options, offers greater range of approximately 1 km, which opens up a raft of IoT use cases.
Read more...
Simple battery charger ICs for any chemistry
Altron Arrow
Editor's Choice Power Electronics / Power Management
The LTC4162 is a highly integrated, high voltage multi-chemistry synchronous monolithic step-down battery charger and PowerPath manager with onboard telemetry functions and optional maximum power point tracking.
Read more...
From the editor's desk: Is the current AI really what we want?
Technews Publishing
Editor's Choice
The companies that develop LLMs need to change direction and concentrate on freeing up our time, not so that we can have more time to do the tasks we don’t want to do in the first place, but rather to allow us more time to do what we love.
Read more...
When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow
Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.
Read more...
ICs vs modules: Understanding the technical trade-offs for IoT applications
NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...
Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.
Read more...
Interview with Brian Aziz, vice president of global sales, Iridium
Editor's Choice
ridium is the leading satellite IoT player. Their network consists of 66 active low Earth orbit satellites covering every inch of the globe and are used for IoT and emergency services worldwide.
Read more...
Accelerating AI adoption in MCU manufacturing
Editor's Choice AI & ML
To gain the value of ML functionality, designers of MCU-based devices have to adopt a new development method and accept a new type of probabilistic rather than deterministic output.
Read more...
Altron Arrow: Empowering innovation with STMicroelectronics AI processors
Altron Arrow
Editor's Choice AI & ML
ST’s AI processors are not only smarter and faster, but also incredibly efficient, enabling a new wave of intelligent solutions across multiple industries.
Read more...
The superpower driving the future of low carbon electricity
Editor's Choice
Modularity is a superpower. The advantage lies in smaller units that can be built, tested, refined, adapted, improved repetitively, allowing many experimentation and learning iterations.
Read more...