Interconnection


Vertical launch high-frequency connectors

10 October 2018 Interconnection

Pasternack has introduced a new line of solderless vertical launch connectors that are ideal for high-speed networking, high-speed computing and telecommunications applications. The series consists of 12 models that provide VSWR as low as 1,3:1 and maximum operating frequency of up to 50 GHz, depending on the model.

These removable launches boast a reusable clamp attachment and can be used for microstrip or stripline. They are offered in male and female versions, covering 2,4 mm, 2,92 mm and SMA interfaces, and all models provide solderless installation.

The vertical launches feature a stainless steel outer conductor, gold-plated beryllium copper centre contact and Polyetherimide (PEI) insulators. They are ideal for high-speed backplanes, signal integrity measurements, semiconductor verification boards, multi-channel tests and SERDES applications.

For more information contact Andrew Hutton, RF Design, +27 21 555 8400, [email protected], www.rfdesign.co.za



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