30 January 2019
Power Electronics / Power Management
The ultra-low-power MAX20345 from Maxim Integrated Products provides a way for designers of always-on wearable and Internet of Things (IoT) devices to extend battery runtime while shrinking form factor. It integrates a lithium charger and debuts a unique architecture that optimises the sensitivity of optical measurements for wearable fitness and health applications.
In wearables, optical sensing accuracy is impacted by a variety of biological factors unique to the user. Designers have been striving to increase the sensitivity of optical systems, in particular the signal-to-noise ratio (SNR), to cover a broader spectrum of use cases.
Traditional low-quiescent-current regulators favoured in wearable applications come with trade-offs that degrade SNR on the wrist, such as high-amplitude ripple, low-frequency ripple and long settling times. Some designers have even turned to high-quiescent-current alternatives to overcome these drawbacks, but they must deal with increased power consumption, which reduces battery runtime or requires a larger battery.
The MAX20345 features a first-of-its-kind buck-boost regulator based on an architecture that’s optimised for highly accurate heart-rate, blood-oxygen (SpO2) and other optical measurements. The regulator delivers the desired low-quiescent-current performance without the drawbacks that degrade SNR and, as a result, can increase performance by up to 7 dB (depending on measurement conditions).
The chip integrates a lithium-ion battery charger; six voltage regulators, each with ultra-low quiescent current; three nanoPower bucks (900 nA typical) and three LDO regulators with quiescent current as low as 550 nA typical. Two load switches allow disconnecting of system peripherals to minimise battery drain. Both the buck-boost and the bucks support dynamic voltage scaling (DVS), providing additional power-saving opportunities when lower voltages can be deployed under favourable conditions.
The MAX20345 is available in a 56-bump, 0,4 mm pitch, 3,37 x 3,05 mm wafer-level package (WLP).
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