The new K32 microcontroller (MCU) series from NXP Semiconductors is optimised for energy efficiency in real-time embedded applications, and enables advanced security with physical tamper protection in a wide range of industrial and Internet of Things (IoT) applications. The power-efficient devices complement the recently launched performance-efficient LPC5500 MCU series.
Building upon the adoption of the Kinetis MCU platform, the K32 series targets energy efficiency for low duty-cycle applications with a wide operating voltage range, and ultra-low leakage power modes that support full SRAM retention and fast wake-up.
First to launch in the series is the K32 L3 family, a 72 MHz Arm Cortex M4-based MCU with an optional Cortex M0+. The device offers up to 1,25 MB Flash memory and 384 KB SRAM, with numerous serial communication interfaces, 12-bit 1 MSps analog-to-digital converter (ADC), 10-bit digital-to-analog converter (DAC) and comparator, 32-bit PWM timer modules, and an external memory controller for flexible expansion. The complete K32 L3 family is planned to support Flash sizes from 512 KB to 1,28 MB, but the full range is available for immediate development from the initial superset.
Other key features include: fast wake-up from 2 μA current with partial SRAM retention, and 7 μA current with full SRAM retention; and a single inductor, multiple output (SIMO) DC-DC converter to maximise energy efficiency, with the added flexibility to provide core power as well as two independent I/O rails, up to 1.8 V.
As little as 200 nA is consumed in always-on VBAT mode, with 32K low-power RTC oscillator and register retention and four tamper pins for physical tamper protection. The MCUs offer an uncompromised Root-of-Trust (RoT) with authenticated boot, encrypted firmware update and storage of public key hash in one-time programmable (OTP) memory. Hardware acceleration is provided for symmetric (AES-256, DES/3DES) and asymmetric (RSA 4096-bit public key, ECC) cryptography, along with SHA-256 hashing and true random number generator (TRNG) with 512 bits of entropy.
Redefining entry-level MCUs NuVision Electronics
DSP, Micros & Memory
The company positions the GD32C231 series as a ‘high-performance entry-level’ solution designed to offer more competitive options for multiple applications.
Read more...High-reliability isolation amplifiers EBV Electrolink
Analogue, Mixed Signal, LSI
The VIA series of isolation amplifiers from Vishay are designed to deliver exceptional thermal stability and precise measurement capabilities.
Read more...Microchip enhances TrustMANAGER platform Altron Arrow
DSP, Micros & Memory
Firmware over-the-air updates and remote cryptographic key management provide scalable solutions for addressing IoT security challenges.
Read more...First NVMe SSD Built with 8th-gen BiCS FLASH EBV Electrolink
Computer/Embedded Technology
KIOXIA recently announced the development and prototype demonstration of its new KIOXIA CM9 Series PCIe 5.0 NVMe SSDs, which incorporates CMOS directly Bonded to Array technology.
Read more...MCU for low-power, IoT applications NuVision Electronics
DSP, Micros & Memory
Silicon Labs recently announced the PG26, a general-purpose microcontroller with a dedicated matrix vector processor to enhance AI/ML hardware accelerator speeds.
Read more...IMU with dual-sensing capability EBV Electrolink
Analogue, Mixed Signal, LSI
ST’s 6-axis inertial measurement unit integrates a dual accelerometer up to 320g and embedded AI for activity tracking and high-impact sensing.
Read more...EEPROMs for industrial and military markets Vepac Electronics
DSP, Micros & Memory
Designed to ensure the data retention and the secure and safe boot of digital systems, the memory product line includes small and medium density EEPROMs from 16 kb to 1 Mb.
Read more...PLCnext – Open, IIoT-ready industrial platform IOT Electronics
DSP, Micros & Memory
PLCnext can be used alongside an existing PLC system, collecting control system data via EtherNet/IP, PROFINET, or MODBUS, and can push this information to a cloud instance.
Read more...ICs vs modules: Understanding the technical trade-offs for IoT applications NuVision Electronics
Editor's Choice DSP, Micros & Memory
As the IoT continues to transform industries, design decisions around wireless connectivity components become increasingly complex with engineers often facing the dilemma of choosing between ICs and wireless modules for their IoT applications.
Read more...Hardware quantum resistance to embedded controllers Avnet Silica
DSP, Micros & Memory
To help system architects meet evolving security demands, Microchip Technology has developed its MEC175xB embedded controllers with embedded immutable post-quantum cryptography support.
printer friendly version