Renesas Electronics announced four new RX651 32-bit microcontrollers (MCUs) supplied in ultra-small 64-pin BGA and LQFP packages.
The new lineup expands the RX651 MCU group with a 64-pin (4,5 x 4,5 mm) BGA package that reduces footprint size by 59% compared to the 100-pin LGA, and a 64-pin (10 x 10 mm) LQFP that offers a 49% reduction versus the 100-pin LQFP. The MCUs address advanced security needs for endpoint devices employing compact sensor and communication modules in industrial, network control, building automation, and smart metering systems operating at the IoT edge.
The RX651 MCUs integrate connectivity, Trusted Secure IP (TSIP), and trusted Flash area protection that enable Flash firmware updates in the field through secure network communications. The increase in endpoint devices operating at the edge has increased the need for secure over-the-air (OTA) firmware updates. The new devices support this reprogramming requirement with integrated TSIP, enhanced Flash protection, and other technology advancements that offer a more secure and stable solution than other available solutions on the market.
The small 64-pin MCUs are based on the high-performance RXv2 core and 40 nm process that provide superior performance with a 520 CoreMark score at 120 MHz, and strong power efficiency with a 35 CoreMark/mA score as measured by EEMBC benchmarks.
The integrated dual-bank Flash memory enables engineers to realise high root-of-trust levels through a combination of TSIP that protects the encryption key; encryption hardware accelerators including AES, 3DES, RSA, SHA and TRNG; and code Flash area protection to protect boot code from reprogramming. The dual-bank Flash function supports both BGO (Back Ground Operation) and SWAP, making it easier for manufacturers to execute in-the-field firmware updates securely and reliably.
Optimised for connected industrial environments, the MCUs’ network connectivity features monitor the operating state of machinery from both inside and outside the factory, enabling data exchanges to change production instructions, and reprogram MCU memory to update equipment settings.
1 GHz crossover MCU with Arm Cortex Cores Future Electronics
DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.
Read more...NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.
Read more...UFS 5.0 flash for on-device AI EBV Electrolink
DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.
Read more...Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...AI-ready edge MPU for HMIs Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact low-power 32-bit platform EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...Low-power memory born for edge AI iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version