In close cooperation with ZVEI (Germany’s Electrical and Electronics Manufacturers’ Association), the PCB Marketplace communications platform is being initiated at electronica for the first time.
Following its successful launch at productronica 2011, the forum as well as a networking area will be a central gathering for the PCB industry at electronica.
The international trade fair for electronic components, systems and applications takes place in Munich from 13–16 November. The PCB Marketplace will feature a diverse lecture programme and it invites visitors to participate in an intense exchange of information on the topic of PCBs, other circuit carriers and EMS.
The Marketplace will be located in Hall C1, while the exhibition sector will be located in Halls B1 and C1 and feature companies such as FELA Leiterplattentechnik, Flextronics International Germany, Multek Europe, Italia, SANMINA - SCI Holding, Würth Elektronik and Zollner Elektronik.
The main themes of the lecture programme include connectors, PCB & EMS (electronic manufacturing services), MCD (material content data) and IMDS (international material data systems).
The first items on the agenda have already been announced: on 14 November, ZVEI will hold a panel discussion on ‘The world of testing – achieving the desired quality safely.’
After that, representatives from companies such as Robert Bosch, Lackwerke Peters and Varioprint will discuss PCB reliability. A list of all lectures at the PCB Marketplace is available in the electronica event database. Additional information about the PCB Marketplace can be accessed at www.electronica.de/supporting-program.
The organisers of electronica also announced that ‘smart energy solutions’ will be one of the main themes this year, with leading manufacturers from around the world presenting their solutions and products in the sectors for energy efficiency, energy storage, LEDs and smart grids. Above all, the future of power grids is expected to be the centre of attention.
Against the backdrop of the global transition to alternative energy sources and the expansion of power grids, technical solutions will be presented for the intelligent supply of power in the future. Leading international executives will also discuss this topic at the CEO Roundtable, the title of which is ‘Semiconductor solutions for smart grid challenges.’
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