Bluetooth 5.0 audio IC and module
25 November 2019
Telecoms, Datacoms, Wireless, IoT
To help Bluetooth speaker and headphone manufacturers maintain product differentiation in the competitive wireless audio market, Microchip Technology released the next generation of its Bluetooth 5.0-qualified dual-mode audio IC and fully certified module.
Measuring just 5,5 x 5,5 mm, the low-power IS2083BM IC is ideal for small form factor designs and gives developers more space to use larger batteries in end products. Both the IS2083BM IC and BM83 module enable customers to reduce bill of materials with highly integrated features, including:
• Embedded mode: Eliminates the need for an external host MCU to support application functionality.
• Integrated power amplifier: The integrated power amplifier includes up to +9,5 dBm output power, removing the need for an external power amplifier.
• Large Flash memory: With an integrated 2 MByte Flash memory, this feature provides the ability to store updated files during over-the-air (OTA) updates and software settings without external storage.
• Support for Sony’s LDAC audio codec technology: This technology extends high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products.
The IS2083BM IC and BM83 module also integrate Bluetooth Low Energy (BLE) Data Length Extension (DLE) and LE Secure Connection (LE SC) that enables approximately 2,5 times higher data throughput and improved security when transmitting data such as during firmware updates.
The IS2083BM IC and BM83 come with a suite of development tools, Microchip’s mobile application and example codes for rapid development.
Further reading:
Industrial Ethernet time sensitive networking switch
RS South Africa
Telecoms, Datacoms, Wireless, IoT
The ADIN3310 and ADIN6310 are 3-port and 6-port Gigabit Ethernet time sensitive networking (TSN) switches with integrated security primarily designed for industrial Ethernet applications.
Read more...
When it comes to long-term reliability of RF amplifier ICs, focus first on die junction temperature
Altron Arrow
Editor's Choice Telecoms, Datacoms, Wireless, IoT
When considering the long-term reliability of integrated circuits, a common misconception is that high package or die thermal resistance is problematic. However, high or low thermal resistance, by itself, tells an incomplete story.
Read more...
Automotive-grade digital isolators
Telecoms, Datacoms, Wireless, IoT
The NSI83xx series of capacitive-based isolators from NOVOSENSE Microelectronics offer superior EOS resilience and minimal power noise susceptibility.
Read more...
Why bis means business for LTE Cat 1 IoT connections
NuVision Electronics
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Tomaž Petaros, product manager IoT EMEA at Quectel Wireless Solutions explains why the market for Cat 1bis IoT connections is getting busy.
Read more...
Wi-Fi in 2025: When is Wi-Fi 7 the answer?
iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Wi-Fi 7 introduces multi-link operation and lower latency, a game-changing feature that allows devices to transmit and receive data across multiple frequency bands simultaneously to significantly reduce network congestion.
Read more...
Bluetooth Lite SoCs purpose built for IoT
NuVision Electronics
Telecoms, Datacoms, Wireless, IoT
Whether it is enabling predictive maintenance on industrial equipment, tracking assets in dense environments, or running for years on a coin cell battery in ultra-low power sensors, developers need solutions that are lean, reliable, and ready to scale with emerging use cases.
Read more...
LTE Cat 1bis module
Otto Wireless Solutions
Telecoms, Datacoms, Wireless, IoT
The A7673X LTE Cat 1bis module from SimCom is engineered to meet the growing demands of the IoT industry, offering exceptional performance and seamless integration.
Read more...
Track with precision
Electrocomp
Telecoms, Datacoms, Wireless, IoT
KYOCERA AVX provides innovative antennas for cellular, LTE-M, NB-IoT, LoRa, GNSS, BLE, UWB, Wi-Fi, and future Satellite IoT.
Read more...
Wi-Fi 7 front-end module
RF Design
Telecoms, Datacoms, Wireless, IoT
The Qorvo QPF4609 is an integrated front end module designed for 802.11be systems that has integrated matching, which minimises layout area.
Read more...
Multi-channel downconverter
Vepac Electronics
Telecoms, Datacoms, Wireless, IoT
The Downconverter from Crane Aerospace is a converter that operates from 2 to 18 GHz and delivers a noise figure of 11 dB with an attenuation range of 25 dB.
Read more...