Further reading:
Quectel’s RG255C-NA and RM255C-GL accelerate 5G RedCap adoption
iCorp Technologies
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Quectel’s RG255C-NA and RM255C-GL modules represent a strategic move into this fast-growing segment, delivering Sub-6 GHz 5G connectivity optimised for mid-tier IoT applications.
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SDRs – Which RF architecture should you choose?
RFiber Solutions
Editor's Choice Telecoms, Datacoms, Wireless, IoT
There are several common methods of implementing SDR architectures. This paper discusses which is best when meeting a specific need.
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Surviving the extremes: Understanding shock and vibration in MEMS sensors
Altron Arrow
Editor's Choice Test & Measurement
By considering factors such as mechanical headroom, damping, and system-level robustness, designers can ensure that the chosen sensor not only survives, but performs reliably over time.
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A two-stage approach to super-wide input voltage range DC-DC converters
RFiber Solutions
Editor's Choice
Teaser: In addition to handling the various input voltage ranges required, the SynQor line of InQor DC-DC converters are fully encased and ruggedised to handle the harsh environments that often accompany systems that have such challenging technical requirements.
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From the editor's desk: Engineering the future
Technews Publishing
Editor's Choice
As we welcome the first issue of Dataweek in a new year, it is an exciting time to be part of the electronics community, especially for our readers. The pace of change across our industry continues to accelerate, reshaping how we design, build, and interact with technology.
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Barracuda commissions new IPC Class 3 aerospace facility
Barracuda Holdings
Editor's Choice News
The company has commissioned a new dedicated IPC Class 3 facility in Somerset West. and has concluded a new investment partnership that will provide the capital and management capacity required to scale operations.
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Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion
Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.
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Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing
Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.
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From the editor's desk: Could X-ray lithography disrupt the economics of advanced chip manufacturing?
Technews Publishing
Editor's Choice
Advanced semiconductor manufacturing has reached a point where technical progress is increasingly constrained by economic reality, and the proposed use of X-ray lithography represents a bold attempt to reset these economics.
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Could the EU’s Cyber Resilience Act affect your electronics manufacturing business?
Altron Arrow
Editor's Choice
South African companies exporting IoT devices to the European Union face a significant regulatory shift with the Cyber Resilience Act becoming mandatory in December 2027.
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