Telecoms, Datacoms, Wireless, IoT


PCIe 2.0 packet switches

29 January 2020 Telecoms, Datacoms, Wireless, IoT

Diodes Incorporated announced the PI7C9X2G304EVQ and PI7C9X2G404EVQ PCIe 2.0 packet switches, offering 3-ports/4-lanes and 4-ports/4-lanes, respectively. The packet switches are automotive-compliant for use in telematics/ADAS, navigation systems, in-vehicle wireless routers, and emerging applications such as V2V and V2X communications.

The parts are designed to provide a simple solution to increase the fan-out of PCIe ports on SoCs, ASSPs, MPUs and FPGAs, supporting advanced features in the automotive industry. The devices are qualified to AEC-Q100 Grade 2, offer an operating temperature range of -40°C to +105°C, are PPAP capable, and are manufactured in IATF 16949 certified facilities.

Interoperability at the system level is guaranteed through compliance with the PCI-SIG PCIe Rev 2.1 standard. At the component level, pin-compatibility with existing Grade 3 solutions from Diodes Incorporated provides an easy migration path to higher performance for existing designs.

Advanced features include an integrated clock buffer and support for peer-to-peer traffic, delivering greater system performance. The low-power operation is complemented by link power management, including active-state power management L0 and L1, device-state power management D0, D3Hot and D3Cold. Power dissipation in L0 is 300 mW (typical), dropping to 35 mW in PCI-PM L1.1 D3Hot PM sub-state mode.

Latency for a packet running through the switch without blocking is 150 ns, and latency tolerance reporting improves platform power management. While the default mode is cut-through, store and forward modes are also supported. Peer-to-peer traffic is enabled through access control service support.


Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Simplifying system design
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
The FGMC63N tri-band MCU Wi-Fi 6E module from Quectel addresses offers integrated connectivity across 2,4 GHz, 5 GHz, and 6 GHz bands in a compact, highly optimised design.

Read more...
Dragino’s connectivity catalogue
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Where Wi-Fi demands frequent charging and covers tens of meters, and traditional cellular consumes too much power for battery-operated nodes, LoRaWAN threads the needle.

Read more...
RF filters explained
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
As RF environments become increasingly crowded, RF filters play a critical role in maintaining signal quality, improving system performance, and ensuring reliable operation.

Read more...
Practical design strategies for 5G
RF Design Telecoms, Datacoms, Wireless, IoT
The Cavli CQM211 aims to provide a platform that combines strong 5G connectivity with onboard compute capability, as well as interface flexibility that suits both new designs and rapid migrations from earlier products.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
GigaDevice expands optical communication portfolio
NuVision Electronics Telecoms, Datacoms, Wireless, IoT
GigaDevice has introduced the new GD32E512 and GD32E252 series MCUs specifically designed for optical module applications.

Read more...
SoC brings scalable edge AI to life
Altron Arrow AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

Read more...
An industry-first Android 16 smart module solution
RF Design Computer/Embedded Technology Telecoms, Datacoms, Wireless, IoT
The MeiG Smart SLM580 4G Smart Module features native support for Android 16 and covers core frequency bands in major countries and regions worldwide.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved