Renesas Electronics announced five new 8,2 mm creepage photocouplers that are the world’s smallest isolation devices for industrial automation equipment and solar inverters. With a package width of 2,5 mm, the RV1S92xxA and RV1S22xxA photocouplers help designers shrink equipment size, increase robot axes, and improve factory floor productivity. They also meet the needs of the zero-energy house that requires smaller solar equipment for more installations in limited space.
The devices are ideal for DC to AC power inverters, AC servo motors, programmable logic controllers (PLCs), robotic arms, solar inverters, and battery storage and charging systems. The RV1S9260A 15 Mbps communications coupler and RV1S9213A intelligent power module (IPM) driver are the first photocouplers to use tiny LSSO5 packages with a 0,65 mm pin pitch, half the pitch of conventional packages.
With a package height of 2,1 mm, the photocouplers can be directly mounted on the backside of a PCB, freeing up valuable space for topside mounted components. Three times infrared reflow soldering provides maximum flexibility. Their electric isolation and high CMR noise rejection (50 kV/µs) protects low-voltage microcontrollers and I/O devices from high-voltage circuits when transferring high-speed signals.
The RV1S2281A and RV1S2211A are DC input and low DC input, transistor output photocouplers, and the RV1S2285A is an AC input, transistor output coupler. The RV1S22xxA devices come in LSSOP packages with a 1,30 mm pin pitch. All five photocouplers deliver 5000 Vrms reinforced isolation and high-temperature operation to withstand harsh operating environments.
The RV1S92xxA and RV1S22xxA photocouplers support 200 V and 400 V systems with reinforced insulation to meet industrial safety standards. All five devices adhere to the strict UL61800-5-1 standard for motor drive equipment, and the UL61010-2-201 standard for control devices such as PLCs.
Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Easy to integrate, quick to react
Opto-Electronics
Würth Elektronik has expanded its range of WL-ICLEDs – RGB-LEDs with integrated controller – to include dual-wire ICLEDs.
Read more...Industrial time-of-flight proximity sensor EBV Electrolink
Opto-Electronics
STMicroelectronics’ VL53L4ED is a compact, high accuracy time-of-flight proximity sensor designed for industrial and embedded applications that require precise short range distance measurement.
Read more...Flexible enclosure lighting solutions IOT Electronics
Opto-Electronics
Phoenix Contact’s range of enclosure lights is designed to provide uniform illumination throughout control cabinets, while offering flexible installation and energy-efficient operation.
Read more...Industry’s smallest laser firing system IC
Opto-Electronics
Silanna Semiconductor recently announced that its FirePower laser firing system ICs for smaller, more efficient LiDAR and rangefinder applications are available in production quantities.
Read more...More light, greater efficiency, better growth Würth Electronics South Africa
Opto-Electronics
Würth Elektronik has expanded its WL-SMDC Horticulture product line with new LEDs with wavelengths of 450, 660, and 730 nm in the 3535 package.
Read more...Intelligent control boosts tunnel safety IOT Electronics
Opto-Electronics
Intelligent tunnel lighting systems are helping operators by delivering adaptive illumination that enhances both safety and energy efficiency.
Read more...Case Study: Turning data into insight Hamamatsu Photonics UK
Editor's Choice Opto-Electronics
Hamamatsu Photonics’ InGaAs PIN photodiode detector has proven consistent, reliable, and robust for more than a decade, helping Axetris to deliver stable, repeatable measurements.
Read more...Reliable imaging for industrial applications Vepac Electronics
Opto-Electronics
Combining a high-performance camera with an integrated high-speed processor, these compact systems enable advanced image sensing directly at the device level.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.