Dataweek will be hosting a one-day seminar targeted at professionals involved in the design and manufacture of electronic and electrical engineering systems. Entitled 'RoHS/Lead-Free in a Day', the event, which will be held in Johannesburg, Durban and Cape Town, will be chaired by Bob Willis, an international expert who provides world-wide training and consultancy in most areas of electronics manufacture.
Bob Willis
Lead-free assembly has an impact on the design, manufacture and the potential reliability of printed board assemblies. Although the fundamental processes do not change, the process parameters do change and there are process issues that arise to affect yields.
The RoHS/Lead-Free in a Day seminar seeks to provide practical insight into the inspection criteria, the changes to process conditions and how to monitor the process to obtain the highest yields. Explaining RoHS, optimising key processes and using technology to reduce costs, the session will also illustrate the potential problems at each stage of manufacture and how to avoid them.
The aim is to give delegates information and knowledge that will allow them to increase the competitiveness of their companies, both in the local and global markets to sell to customers requiring RoHS compliance.
The presenters are all leading experts in the electronics manufacturing process. In addition to Bob Willis, they include: Keith Bryant, a production engineer and director of the UK SMART Group, and member of the SMTA and the ICT; Mike Fenner, technical projects manager for Indium Corporation's European operations; and Josef Jost, owner/managing director of Balver Zinn, a leading provider of products utilised in the PCB and electronics industries.
Keith Bryant
Mike Fenner
Josef Jost
The dates scheduled are: 31 October 2006 in Johannesburg; 1 November in Durban; 2 November in Cape Town (Stellenbosch).
For more information contact Malckey Tehini, Technews, +27 (0)11 886 3640, [email protected]
From the editor's desk: Is the current AI really what we want? Technews Publishing
Editor's Choice
The companies that develop LLMs need to change direction and concentrate on freeing up our time, not so that we can have more time to do the tasks we don’t want to do in the first place, but rather to allow us more time to do what we love.
Read more...Events
Events Securex South Africa 2025
3-5 June 2025
Gallagher Convention Centre, Midrand
Securex provides a comprehensive platform for end users to source their security solutions, and is a proven source of multiple ...
Read more...From the editor's desk: Are we really being ripped off? Technews Publishing
News
To the surprise of many customers, installing solar panels does not always eliminate their utility bill – and in some cases, the power utility may impose additional charges on solar-powered homes.
Read more...Events
Events AATF
6-8 May 2025
Gallagher Convention Centre
With its theme of ‘Future Ready Smart Solutions’, Africa Automation Technology Fair (AATF2025) promises to be an immersive industrial automation technology ...
Read more...Tech Talks – Enabling AI/ML at the edge
Events
This session will explore how developers can add AI/ML inferencing to standalone or wired devices, with the flexibility to incorporate wireless capabilities when ready.
Read more...Webinar - How to develop intelligent edge IoT devices
Events
Join Quectel’s expert-led webinar, with a speaker from Qualcomm Technologies, to learn more about how one can plan, test and deploy successful IoT devices drawing on the unique advantages of intelligence at the edge.
Read more...EVENTS
Events AATF
6-8 May 2025
Gallagher Convention Centre
With its theme of ‘Future Ready Smart Solutions’, Africa Automation Technology Fair (AATF2025) promises to be an immersive industrial automation technology ...
Read more...Webinar: Design-created micro-climates
Events
Aqueous Technologies is hosting a webinar titled ‘Localised harsh environments and ECM: Design-created micro-climates – the hidden threat within electronic devices’ that deals with the threat of moisture accumulation on a PCB’s surface.