Planar inductive components have become a mainstream technology. For compact, low profile power converter modules - known as 'bricks' - they are the standard.
While the technology as such has been accepted, design optimisation is still ongoing in the striving for highest power density. The first core shape that resulted in a standardised planar series was the planar E core, a low profile vertical variation of the conventional E core. The especially round centre leg shapes are well suited for compact designs.
Ferroxcube has introduced two new core sizes: ER18 and ER23. These are a logical continuation of the existing smaller ER cores ER9.5, ER11 and ER14.5, which can also be used in planar designs. Aimed at the high-density power conversion market, the new sizes are launched in the high saturation/high frequency materials 3C92, 3C96 and 3F35.
Applications
A typical application for the ER18 and ER23 can be found in DC-DC converter modules in telecom switches. They convert the intermediate DC supply voltage (12-48 V) to the PCB board level (1,0-3,3 V). Trends are increasing throughput power density and large output currents because semiconductor voltages go down. This requires a uniform core cross-section and high-grade materials, but also more effective copper conductors. A round centre leg has principally the shortest copper tracks for a given core cross-section and therefore the lowest DC resistance and smallest footprint area. The winding window must be kept sufficiently large to limit the current density, which relates directly to the temperature rise due to the copper losses. The core cross-section is less dominant for lower voltages, so the ratio of core cross-section to winding area can go down. Together these requirements lead to an ER-like core shape. The ER18 is intended for quarter brick designs (110 W, 40-60 A) and the ER23 for half brick designs (150 W, 60-80 A).
The main features of the cores are: round centre leg; short copper tracks; low DC resistance; small footprint area; high power density; large winding window, large output current; uniform core cross-section; maximum ferrite usage; high grade ferrite materials; high saturation/high frequency.
For further information contact Leslie Govender, Arrow Altech Distribution, 011 923 9600, [email protected]
Cost-effective microcontroller series Altron Arrow
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
Read more...Understanding two key tools for cleaner serial data Altron Arrow
Editor's Choice Analogue, Mixed Signal, LSI
Understanding how pre-emphasis and equalisation works, and when to use one over the other, is critical when designing reliable high-speed systems.
Read more...Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Tiny noise suppression filters RS South Africa
Passive Components
TDK Corporation recently announced its latest noise suppression filters of the MAF0603GWY series, which measure only 0,6 x 0,3 x 0,3 mm.
Read more...Compact 1250 V choke solution Electrocomp
Passive Components
TDK Corporation has introduced a new high-voltage common-mode choke series designed to support more compact and efficient 1250 V DC converter architectures in next-generation power electronics.
Read more...Ultra-low jitter clocks Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Skyworks has introduced a new family of ultra-low jitter programmable clocks designed to meet the increasing demands of next-gen connectivity.
Read more...Efficient Bluetooth SoC Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The EFR32BG29 wireless SoC from Silicon Labs is a highly efficient, high memory, low-power, and ultra compact SoC designed for secure and high-performance wireless networking for IoT devices.
Read more...RTOS – The future of embedded systems Altron Arrow
Edge Computing & IIoT
At the heart of the next generation of embedded devices is efficient yet powerful system-level code, often based on an open-source real-time operating system.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.