Passive Components


New ER cores for planar converters

9 April 2003 Passive Components

Planar inductive components have become a mainstream technology. For compact, low profile power converter modules - known as 'bricks' - they are the standard.

While the technology as such has been accepted, design optimisation is still ongoing in the striving for highest power density. The first core shape that resulted in a standardised planar series was the planar E core, a low profile vertical variation of the conventional E core. The especially round centre leg shapes are well suited for compact designs.

Ferroxcube has introduced two new core sizes: ER18 and ER23. These are a logical continuation of the existing smaller ER cores ER9.5, ER11 and ER14.5, which can also be used in planar designs. Aimed at the high-density power conversion market, the new sizes are launched in the high saturation/high frequency materials 3C92, 3C96 and 3F35.

Applications

A typical application for the ER18 and ER23 can be found in DC-DC converter modules in telecom switches. They convert the intermediate DC supply voltage (12-48 V) to the PCB board level (1,0-3,3 V). Trends are increasing throughput power density and large output currents because semiconductor voltages go down. This requires a uniform core cross-section and high-grade materials, but also more effective copper conductors. A round centre leg has principally the shortest copper tracks for a given core cross-section and therefore the lowest DC resistance and smallest footprint area. The winding window must be kept sufficiently large to limit the current density, which relates directly to the temperature rise due to the copper losses. The core cross-section is less dominant for lower voltages, so the ratio of core cross-section to winding area can go down. Together these requirements lead to an ER-like core shape. The ER18 is intended for quarter brick designs (110 W, 40-60 A) and the ER23 for half brick designs (150 W, 60-80 A).

The main features of the cores are: round centre leg; short copper tracks; low DC resistance; small footprint area; high power density; large winding window, large output current; uniform core cross-section; maximum ferrite usage; high grade ferrite materials; high saturation/high frequency.

For further information contact Leslie Govender, Arrow Altech Distribution, 011 923 9600, [email protected]



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

RF agile transceiver
Altron Arrow Telecoms, Datacoms, Wireless, IoT
The AD9361 is a high performance, highly integrated RF Agile Transceiver designed for use in 3G and 4G base station applications.

Read more...
SmartRAID 4300 Series
Altron Arrow DSP, Micros & Memory
Microchip’s disaggregated architecture leverages host CPU and PCIe infrastructure to overcome traditional storage bottlenecks in scalable, secure NVMe RAID storage solutions.

Read more...
The evolution of 4D imaging radar
Altron Arrow Telecoms, Datacoms, Wireless, IoT
4D imaging radar is redefining automotive sensing with unmatched precision, scalability and resilience and, as global adoption accelerates, this technology is poised to become a cornerstone of autonomous mobility.

Read more...
Bluetooth wireless SoC
Altron Arrow Telecoms, Datacoms, Wireless, IoT
he EFR32BG29 wireless SoC from Silicon Labs is a highly efficient, high memory, low-power, and ultra compact SoC designed for secure and high-performance wireless networking for IoT devices.

Read more...
Wide frequency range inductors
RS South Africa Passive Components
TDK Corporation has expanded its ADL4524VL series (4,5 x 2,4 x 2,6 mm – L x W x H) of wire-wound inductors for automotive power-over-coax.

Read more...
Wi-Fi 6 and Bluetooth LE co-processor
Altron Arrow Telecoms, Datacoms, Wireless, IoT
STMicroelectronics has released its ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE combo co-processor module.

Read more...
Empowering innovation with ST’s AI processors
Altron Arrow AI & ML
Artificial intelligence is no longer just a futuristic concept – it is here, and it is transforming industries at an unprecedented pace.

Read more...
1-Wire EEPROM with secure authenticator
Altron Arrow DSP, Micros & Memory
The DS28E54 secure authenticator combines FIPS 202-compliant secure hash algorithm (SHA-3) challenge and response authentication with secured electrically erasable programmable read-only memory.

Read more...
The 6 GHz band radio solution
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Analog Devices’ 16 nm transceiver family offers a highly integrated solution for this new frequency band, featuring low power consumption and high performance.

Read more...
New clock generator family
Altron Arrow Telecoms, Datacoms, Wireless, IoT
Based on Skyworks’ fifth generation DSPLL and MultiSynth technologies, these devices enable any-frequency, any-output clock generation.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved