23 April 2003Manufacturing / Production Technology, Hardware & Services
Developed in response to customer requirements, DEK has announced that its new Via Fill process delivers 100% fill of substrate vias with no voids and minimal surface residue. The technique uses DEK's ProFlow DirEKt Imaging system and is claimed to achieve superior fill results with aspect ratios of up to 8:1.
The Via Fill system is highly repeatable and results in a throughput of over five times faster than the traditional squeegee-based fill process, as well as greater accuracy, according to the company. Cost savings resulting from increased utilisation of manpower and reduced wastage are also realised, while process control is enhanced. The ProFlow-based process can solve problems such as insufficient fill, voiding, poor throughput and excessive handling of the product associated with conventional methods.
Dek says that the fully-enclosed ProFlow head is used in conjunction with a sheet of blotting paper underneath the substrate and on top of the tooling block to fill vias in just two print passes, with a paste pressure of 250 kPa and a print speed of 25 mm/s. In addition, the print material has been shown to have a life of over three months in the transfer head. Traditional manual or squeegee-based systems are not only far less clean and operator-friendly, but they typically take multiple passes to push material into vias. They can also use a vacuum table to pull material through, resulting in both voids and inadequate deposition.
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