DSP, Micros & Memory


Demo board for low pin-count PICmicros

21 May 2003 DSP, Micros & Memory

Microchip is offering its new PICDEM 4 Demonstration Board that it says helps engineers to evaluate and demonstrate the advanced capabilities of the company's low pin-count PICmicro Flash microcontrollers.

The PICDEM 4 offers multiple socket options for immediate programming and debugging of 8-, 14-, and 18-pin PIC12F, PIC16F and PIC18F microcontrollers. The board demonstrates many of the features of low pin-count parts, including Local Interconnect Network and motor control capability using the enhanced capture/compare/PWM module. Low-power operation is achieved with a supercapacitor circuit and jumpers allow the on-board hardware to be disabled to eliminate current draw.

The demo board also includes provision for crystal, RC or canned oscillator modes and a 5 V regulator for use with a 9 V supply, or hooks for a 5 V, 100 mA regulated DC supply. Additional features include an RS232 interface, an EEPROM footprint, 2x16 liquid crystal display, PCB footprints for an H-Bridge motor driver, LIN transceiver, and a connector for programming via In-Circuit Serial Programming technology and developing with the MPLAB ICD 2 in-circuit debugger.

The demonstration board (DM163014) includes two PICmicro Flash microcontrollers and a CD-ROM containing sample programs, application notes and user guide.

For more information contact Avnet Kopp, 011 809 6100, Memec SA, 011 897 8600 or Tempe Technologies, 011 452 0530.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

1 GHz crossover MCU with Arm Cortex Cores
Future Electronics DSP, Micros & Memory
i.MX RT1170 Crossover MCUs, from NXP Semiconductor, are dual-core devices featuring an Arm Cortex-M7 and Arm Cortex-M4 for real-time microcontroller (MCU) performance and high integration for automotive, industrial and IoT applications.

Read more...
NECTO studio update 7.5.0
DSP, Micros & Memory
MIKROE have continued their collaboration with Renesas by introducing support for the RL78 architecture in NECTO Studio, expanding the IDE beyond its existing MCU platforms.

Read more...
UFS 5.0 flash for on-device AI
EBV Electrolink DSP, Micros & Memory
UFS 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency and capacity required for the next generation of AI-enabled mobile and edge devices.

Read more...
Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
AI-ready edge MPU for HMIs
Future Electronics DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.

Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact low-power 32-bit platform
EBV Electrolink DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.

Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.

Read more...
Low-power memory born for edge AI
iCorp Technologies DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved