Vicor has introduced a new power system architecture based on an array of proprietary power conversion technologies. According to the manufacturer, the new architecture, called Factorized Power Architecture (FPA) will provide power system designers with breakthrough performance at a lower cost than attained with conventional Distributed Power Architecture (DPA), including Intermediate Bus Architecture (IBA). FPA and its enabling V•I Chips will supersede the conventional model based on 'high-density' DC-DC converter 'bricks' and non-isolated Point Of Load converters, says Vicor. Here, the company describes the V•I Chips.
About V•I Chips
FPA is enabled by power conversion components called V•I Chips or VICs. V•I Chips can efficiently process up to 200 W of power in a small (less than 4,1 cm3) and light (less than 13 g) power Ball Grid Array (BGA) package, with power density up to 48,8 W/cm3 - five times better than the closest industry standard. These functional building blocks will be deployed as surface mount (SMD) components to create a flexible Factorized Power system.
One VIC type, the Pre-Regulator Module (PRM), is designed to accept a wide-range supply voltage and convert it to a Factorized Bus - a controlled voltage source - with 97% to 99% efficiency. Another VIC type, the Voltage Transformation Module (VTM), is designed to convert the Factorized Bus to the voltage levels required by the load with efficiencies as high as 97%. The VTM will also provide input to output galvanic isolation. With an effective switching frequency of 3,5 MHz, the VTM responds to dynamic loads 20 times faster than the fastest competitive brick type converter.
Because of the inherent flexibility of Factorized Power and the performance superiority of V•I Chips, Vicor believes that a wide variety of systems and applications can benefit from their deployment. For example:
Systems with advanced, high-speed microprocessors requiring on-board power at high current and low voltage can draw as much as 80 A at up to 2,5 V from a single VTM. The VTM's ability to respond to changes in microprocessor current in less than 1 µs outperforms typical sub-MHz, hard-switching, multiphase VRMs while at the same time reducing system complexity and cost.
Electrical and electronic systems in vehicles requiring a multiplicity of high and low voltages can benefit from the high density, high efficiency and low electrical noise of V•I Chips. The high temperature performance, thermal management versatility and inherent ruggedness of V•I Chips should provide compatibility with harsh application environments, such as found in automobiles.
Consumer and other electronic products requiring small, lightweight and low profile power systems that are cost-effective can benefit from the VIC's ability to operate within a height of only 4 mm over the PCB.
V•I Chips are shipped in JEDEC trays or taped and reeled for use with automated pick and place equipment.
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