Selective soldering system handles mixed assembly boards in-line
4 June 2003Manufacturing / Production Technology, Hardware & Services
Most of today's PC boards present a co-existence of through-hole and surface mount packages on the same board (mixed assembly). Whenever a board's secondary side contains devices that cannot go through wave solder without costly protective fixtures, the through-hole components must be selectively soldered without impacting the adjacent components already soldered.
To overcome the problem, BeamWorks has developed Spark 100, an in-line selective soldering system that uses a power controlled diode laser with closed loop temperature and solder volume control for the soldering of through-hole (TH) components. The high power diode laser provides high performance, low operation costs, long life and minimal maintenance, says BeamWorks.
Operation
Spark 100 enables soldering from the bottom of the board, which eliminates the need to flip the board prior to the soldering process. This allows the user to truly incorporate the machine in the SMT line. The Spark 100 uses a vision system for auto alignment, simple download of CAD data to create programs, and an offline editor to allow users to program away from the machine. Using fiducials for alignment, and CAD data for locating the leads, significantly reduces costs and programming time.
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