Bourns offers Model 3223 from its trimpot product line, the latest addition to its SMD family of products. Model 3223 is claimed to be the first 3 mm square multiturn SMD sealed trimmer in the market. This trimmer was designed for applications where accuracy in adjustment is crucial and board space is limited. As a world leader in trimmer technology, Bourns continues to fill the market demand for smaller products while maintaining the accuracy in adjustment that currently is only available in larger multiturn trimmers.
The sealed construction allows the trimmer to withstand today's typical board processes such as IR and forced hot air convection solder reflow. Recommended solder processing specifications are available upon request or may be found on the Bourns website.
Key features are:
* Vertical adjustment; pick and place centring design with flush adjustment; surface mount; 3 mm size; 11 turns.
The Model 3223 requires 42% less board space while maintaining similar electrical characteristics to its 4 mm counterpart says the manufacturer.
For more information contact Leslie Govender, Arrow Altech Distribution, 011 923 9600, [email protected]
Accelerate development of physical AI deployments Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...Nanocrystalline cores for cable assembly Würth Electronics South Africa
Passive Components
Conventional MnZn and NiZn ferrite cores for cable assembly are now complemented by nanocrystalline cable cores.
Read more...Universal NFC device Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...SoC brings scalable edge AI to life Altron Arrow
AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.
Read more...Compact direct Time-of-Flight 3D LiDAR module Altron Arrow
Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...Cooling solutions for modern electronics Future Electronics
Passive Components
As electronic systems become more compact and powerful, effective thermal management has become a critical aspect of product design.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.