Highest-density single-chip packet processor demonstrated

Electronics Technology

18 June 2003 Electronics Technology

Zarlink Semiconductor showcased what it says is the industry's highest-density, single-chip, TDM-to-Ethernet packet processor during a 'SUPERDemo' of Ethernet interoperability at the Supercomm 2003 conference. Using its newest packet processor technology, Zarlink demonstrated seamless interworking between TDM circuit-switched facilities and packet networks by transporting T1/E1 TDM voice with carrier-class quality over a next-generation, metropolitan Ethernet network. The TDM-to-Ethernet interworking achieved by the packet processor - a capability known as CESoP (circuit emulation services over packet) - can simultaneously deliver CES for 32 T1/E1 lines, or 1024 TDM circuits. At the demo, two CESoP evaluation boards, each with a packet processor, demonstrated error-free operation of a T-line (TDM line) across the Metro Ethernet Forum's new E-line (Ethernet point-to-point) service. The TDM interfaces on Zarlink's boards were connected to either: handsets via PCM CODECs; or to E1 testers via line interface units. The boards' Ethernet ports were connected to the metro Ethernet network via off-the-shelf PHYs (physical layer devices).

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Highest-density single-chip packet processor demonstrated

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