32-bit microcontroller family based on ARM7TDMI-S core
16 July 2003
DSP, Micros & Memory
Access Control & Identity Management
Royal Philips Electronics has released what it says is the semiconductor industry's first 32-bit ARM7TDMI-S processor core microcontrollers on a 0,18 mm CMOS embedded Flash process. This process enables low 1,8 V voltage operation and very high embedded Flash performance, which is well suited to realtime applications such as automotive, medical, networking, Internet connectivity, and battery-powered consumer products.
Targeting 16/32-bit microcontroller designs, the LPC2100 family (48-pin Chip Scale Package) offers Philips customers a smooth low-cost migration path from 8-bit and 16- bit to 32-bit microcontrollers.
Optimised for both high performance and low power, the LPC2100 family operates at 60 MHz (54 Dhrystone MIPs) and features 128-bit wide zero wait-state Flash, unlike competing solutions whose performance is limited due to multiple wait-state Flash. This zero wait-state Flash performance is ideal for realtime embedded applications. Philips chose the ARM7TDMI-S core with realtime monitor and realtime trace as the heart of the new device to allow customers to take advantage of broad industry support for the core with currently available software applications and tools from third-party vendors.
The LPC2100 microcontroller family is based on a common system architecture approach with the same memory map, vectored interrupt controller, Flash programming and updating mechanism, peripheral complement, and debugging and emulation facilities common to all ARM family members.
The LPC2104, LPC2105, and LPC2106 will feature 16 to 64 KB of SRAM. The LPC2100 family is supported by tools and development support environments provided by tool partners including ARM, Ashling, Hitex, Keil Software, Nohau and Phytec.
For more information contact Mutronics (Value Added Distributor), 011 608 1460.
Further reading:
Accelerate development of physical AI deployments
Altron Arrow
DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N-
AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.
Read more...
AI-ready edge MPU for HMIs
Future Electronics
DSP, Micros & Memory
The Renesas RZ/G3E MPU is a high-performance microprocessor designed to enable advanced HMI systems with integrated artificial intelligence capabilities at the edge.
Read more...
Industrial-grade ESP32-S3 controller
DSP, Micros & Memory
Erqos Technologies has introduced the EQSP32CE, a CE-certified, industrial-grade ESP32-S3 controller designed for developers who want the flexibility of the ESP32 ecosystem in hardware that can be deployed directly into real-world automation.
Read more...
Universal NFC device
Altron Arrow
DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.
Read more...
Compact low-power 32-bit platform
EBV Electrolink
DSP, Micros & Memory
Microchip’s PIC32CM PL10 microcontroller family expands the company’s Arm Cortex-M0+ portfolio, delivering a compact, low-power 32-bit platform designed for cost-sensitive embedded applications.
Read more...
Bridging the gap between prototype and production
DSP, Micros & Memory
Choosing between the FRDM i.MX 93, FRDM i.MX 91 and FRDM i.MX 91S development platforms can be intimidating, but once designers understand how each platform aligns with their application’s requirements, the decision becomes straightforward.
Read more...
Low-power memory born for edge AI
iCorp Technologies
DSP, Micros & Memory
As intelligence moves from the cloud to the device, memory become one of the most important design decisions in modern electronics. Edge-AI products – from smart speakers and surveillance cameras to ADAS modules and wearables – need to move data fast, but they also need to sip power. Winbond’s low-density LPDDR4/LPDDR4X SDRAM range is built to strike that balance.
Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow
AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.
Read more...
Next-gen smart module powers intelligence at the edge
iCorp Technologies
DSP, Micros & Memory
Quectel Wireless Solutions has expanded its smart module portfolio with the SH803FD, a new-generation, high-performance smart module.
Read more...
Programmable logic redefined
DSP, Micros & Memory
Microchip’s CLB-based PIC MCUs combine programmable logic and embedded control in a single device to help reduce latency, cost, and design complexity.
Read more...
printer friendly version