As demand for RFI shielding has risen significantly, the need for an effective way to mount shields has now been addressed by Harwin. Traditionally, shielding cans are soldered directly to the printed circuit board during assembly, making rework an expensive and time consuming process. Many applications require components to be 'tuned' prior to the shields being fitted, thus adding an expensive manual solder operation to the final cost.
Harwin has recognised that this is a significant issue with many customers and now offers the surface-mount RFI shield clip as a simple solution to address these issues. This allows the shielding cans to be fitted and removed several times, allowing rework or tuning, if required with no degradation in performance or risk of damage to the circuit boards.
The clips are supplied in EIA standard tape and reel packaging and can be placed onto the PCBs with any standard surface-mount placement machine. The clips are fitted during the main board assembly process and soldered as any other SMT product, with the clip self centring during reflow on the PCB pad. This eliminates the additional expense of secondary hand placement soldering operations and ensures optimal alignment.
Once the SMT shield clip is placed and soldered, the RFI shielding can then be fitted into the spring contacts. The shield clip contacts have been designed to retain the shield mechanically and also provide effective electrical connection to ground the shielding cans.
For more information contact Robert Reynolds, Arrow Altech Distribution, 011 923 9600, [email protected]
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