Manufacturing / Production Technology, Hardware & Services


BeCu is versatile and reliable for specialised applications

8 October 2003 Manufacturing / Production Technology, Hardware & Services Financial (Industry)

Multi-Alloys distributes a range of beryllium copper wire and strip products locally on behalf of Brush Wellman. BeCu (beryllium copper) is the strongest copper alloy, the most conductive, as well as the most formable high strength alloy, and is available in heat-treatable and mill-hardened versions, making it ideally suited for a diverse range of specialised applications, eg, shielding to meet emission and sus-ceptibility requirements.

BeCu features excellent resistance to temperature relaxation and also shares the good corrosion resistance of copper alloys such as bronze and brass. With no hydrogen embrittlement better fatigue life in humid atmospheres is possible. It is easy to plate and solder and being non-magnetic is the best spring material for disk drives, guidance systems and meter movements.

Fingerstock is the largest user of copper beryllium strip and is one of the most common types of shielding used. Available in a variety of shapes, forms and sizes, shielding protects circuit boards, connectors, etc. against radiated electromagnetic energy. Methods of shielding can also vary greatly. There are four principles of shielding gaskets: beryllium copper spring fingers, beryllium copper wire mesh hollow core tubing, Monel/SnCuFe wire mesh and metal filled conductive elastomers. These RF gasket materials have distinct advantages and disadvantages, depending on the application.

Regardless of gasket type, the most important factors to be considered are: impedance (R +jX) where R is resistance and jX the inductive reactance; shielding effectiveness; material compatibility; corrosion control; compression forces; compressibility; compression range; compression set and environmental sealing.

Shielding is the only suppression technique with no impact on current high-speed electronic devices and effectiveness depends primarily upon the number, configuration and treatment of discontinuities in the shield.

For more information contact Ken Perel, Multi-Alloys, 011 466 2480, [email protected]





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Outscale your competition
Manufacturing / Production Technology, Hardware & Services
Attendees will be able to explore the benefits of AMD Kintex UltraScale+ Gen 2 FPGAs in high-performance Pro AV, test & measurement, industrial, and medical applications.

Read more...
MTN SA Foundation drives youth pathways into the digital economy
Manufacturing / Production Technology, Hardware & Services
The MTN SA Foundation, in partnership with Helios Towers and Datacomb Development Hub, has launched the MTN–Helios Towers 12-month ICT Learnership Programme, a pathway that takes young South Africans from digital training into real workplace experience.

Read more...
Downstream demand, system reliability, and the expanding role of engineering-led distribution
Manufacturing / Production Technology, Hardware & Services
[Sponsored] As South Africa’s semiconductor demand continues to be shaped by downstream system deployment rather than upstream fabrication, the importance of engineering-led distribution will continue to grow.

Read more...
From friction to trust
Information Security Security Services & Risk Management Financial (Industry)
Historically, fraud prevention has been viewed as a trade-off between robust security and a seamless customer journey, with security often prevailing. However, this can impair business functionality or complicate the customer journey with multiple logins and authentication steps.

Read more...
The impact of harsh environments and ionic contamination on post-reflow circuit assemblies
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
There is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms, but modern electronic assemblies are far more susceptible to this phenomenon.

Read more...
Engineering copper grain structure for high-yield hybrid bonding in 3D packaging
Testerion Editor's Choice Manufacturing / Production Technology, Hardware & Services
The way copper grains are sized and distributed forms the metallurgical foundation of hybrid bonding, enabling lower bonding temperatures, greater reliability, and stable grain structures throughout integration.

Read more...
Understanding solder dross: causes and control strategies
Truth Electronic Manufacturing Editor's Choice Manufacturing / Production Technology, Hardware & Services
Dross formation is an inevitable consequence of wave soldering. It occurs when molten solder comes into contact with oxygen, forming metal oxides that float on the surface of the solder bath. Over time, this oxidation byproduct accumulates and must be removed to maintain solder quality and process consistency.

Read more...
Non-destructive techniques for identifying defects in BGA joints – TDR, 2DX, and cross-section-SEM comparison
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
This whitepaper reports the results of a comparison of the following techniques: TDR, automatic X-ray inspection (AXI), transmission X-ray (2DX), cross-section/SEM, and Dye & Pry.

Read more...
Implications of using Pb-free solders on X-ray inspection of flip chips and BGAs
MyKay Tronics Manufacturing / Production Technology, Hardware & Services
With the move to Pb-free soldering, most of the attention has been paid to reflow temperatures, component compatibility, and reliability concerns, but the implications for inspection, particularly X-ray inspection, are equally important and often underestimated.

Read more...
The causes of solder balls in robotic soldering
Manufacturing / Production Technology, Hardware & Services
Solder balls (also known as solder splatter) are a major concern in many production sites as they may potentially cause shorts, leading to long-term impacts on product reliability.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved