Manufacturing / Production Technology, Hardware & Services


High speed placement head extends performance

28 January 2004 Manufacturing / Production Technology, Hardware & Services

Universal Instruments used the recent Productronica show to launch its high speed Lightning placement head that extends the performance of its Genesis and AdVantis solder machine platform systems. The new head features a radial array of 30 modular, individually controlled spindles.

The unique configuration delivers productivity-enhancing features that drive placement rates up to 54 000 cph spec speed for Genesis, and 30 000 cph for AdVantis.

Universal says that Lightning comes to market as the industry's fastest placement head technology with a duty cycle of just 60 ms - a pick-to-pick or place-to-place performance that delivers chipshooting speeds in a platform system that succeeds in maintaining commonality of feeders, vision, heads and software with other Universal platform equipment.

The unique rotary motor drive developed for Lightning is based on Universal's patented VRM (variable reluctance linear motor) technology. The new direct-drive rotary 'Phi' motion VRM was conceived, developed and manufactured by Universal to feature fewer parts, improve reliability and deliver exceptional motion performance.

Dual on-the-head optics allow Lightning to address an unsurpassed range of components from 01005 (one-quarter the area of 0201s) to 30 x 30 mm and supports component pre-orientation as well as on-the-head rejection for small parts to further enhance throughput and productivity. The plug-in spindle modules are designed to be quickly and easily replaced and each contains a tiny 'Airkiss' venturi vacuum generator to maintain a very short and low maintenance vacuum path. As a result, Lightning places devices such as CSP, WSP, uBGA, and Melfs at full speed.



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