28 January 2004Manufacturing / Production Technology, Hardware & Services
Products & Solutions
For heat dissipation from integrated circuits of the type BGA and similar, Fischer Elektronik has designed special heatsinks.
Heatsinks with heights of 6 and 10 mm have been optimised to suit these BGA circuits with dimensions between 10 x 10 mm and 42 x 45 mm. The shape of the pin fins allows efficient heat dissipation with free convection, especially in the case of moving air, and the geometry of the heatsinks efficiently furthers multidirectional air flow.
Installation on the BGA boards is made using either thermally conductive adhesive or special, thermally conductive foil cut to size, which is self-adhesive on both sides. In addition, special designs are possible.
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