Manufacturing / Production Technology, Hardware & Services


Do not be afraid of lead-free soldering

21 April 2004 Manufacturing / Production Technology, Hardware & Services

1 July 2006 will be the day when lead-free soldering finally becomes law for the manufacturers and suppliers of electronic components in Europe. Time is running short and many small- and medium-sized companies, but also, large industrial producers feel left alone with the changes to come.

True, the issue has been discussed and researched for years - but where is the support when it comes to the real problems?

Ersa, a leading European soldering systems supplier, is known to confront the problems of lead-free soldering, and answers process-related questions. Ersa considers the influence and interaction of various parameters: solder alloy; flux; PCB material; coating; component types; layout, topology.

On each production run, Ersa's special tool covers every inch of soldering technology. The company's product portfolio ranges from reflow machines for high-volume production over wave soldering and selective soldering, to repair, hand soldering tools and inspection systems. Each area has its very own questions with regard to lead-free soldering; and each area needs its very own solution. Ersa specialists can offer their customers the experience and know-how gained on production sites in all parts of the world.

A look into the lead-free future

Today, many Ersascope Inspection Systems are being used for the monitoring and analysis of hidden, lead-free soldering joints. Non-wetting problems, a significant problem in lead-free soldering, can be detected just as easily as irregularities on PCB soldering globules due to 'too high' or 'too low' temperatures. The innovative Ersascope 2 Optical Inspection System can identify bridging or solder squirts even beneath flip chips. It is absolutely necessary to document the findings about the surface structure of a good, lead-free soldering joint and to thus assure quality. This is done by means of the ImageDoc EXP 2.0 software package, an ideal assistant, as its extensive data bank offers solutions to the known problems in lead-free soldering.

As the process window for lead-free produced PCBs is narrower, the number of process defects will most likely increase during the changeover phase. We might even experience new, and up to now, unknown defects: a challenge to quality engineers, and a challenge to develop appropriate test strategies. This is particularly true for older production equipment that may not be able to cope with the narrow process window. In combination with the ImageDoc EXP 2.0 quality assurance software, both the traditional as well as the new, second-generation Ersascope are indispensable high-performers.

True to the principle from pre-lead-free days: Ersa believes that once you detect the defect and determine its cause, its elimination is just a matter of time.

Defect detected - danger averted

For many years, the most important tools in defect elimination and rework in electronics, has been the reliable Ersa Soldering Stations, and since the adoption of surface mount technology, the Ersa IR Rework Systems. Both groups already meet the requirements for lead-free soldering. With these, the defect rate caused by defective soldering joints is minimised.

Ersa's Soldering Stations for professional users are known for their highly precise temperature control at the solder tip. Thanks to optimum heat transfer from heating element to tip and the high-performance heat recovery, the lead-free soldering joint receives just the amount of energy to form to perfection. Ersa's solder tips are tailor-made to lead-free solders. The Ersa Soldering Stations help ensure that hand soldering will not become the Achilles' heel in lead-free applications.

The equally-capable Ersa IR Rework Systems have also proved their worth in more than 4000 installations worldwide. The controlled and therefore mild, radiated heat with 'no-touch temperature measurement' on the PCB, is unique and performs well in many lead-free applications.

The IR 550 A with its visual process control and the possibility of being calibrated to the melting point temperature of each and every solder alloy, makes selective lead-free reflow process particularly safe. The closed loop system renders the repair of lead-free, low-speed components safe and easy for even inexperienced users. Components and substrates are spared and exposed to temperatures that are just as high as required by the process. The soldering technology makes it impossible for defects to be caused by hot process gas or imprecise measurements due to aged thermocouples.

Documentation

Again, all rework process results can be documented in detail by means of the IRSoft 2.1 software package and this serves as basis to the final control of the lead-free process. The right tools will allow for a smooth changeover to the lead-free soldering process.

Ersa is assisting its customers as a competent partner and future-oriented supplier of complete soldering solutions. It can help manufacturers with their transition to lead-free.



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