Interconnection


High speed interconnects provide multiple design solutions

21 April 2004 Interconnection

Samtec's expanded High Speed Interconnect product line includes a large variety of new micro pitch (0,5 mm, 0,635 mm and 0,8 mm) interconnects with controlled impedance for enhanced signal integrity. These interconnects are designed to minimise crosstalk and optimise capacitance and inductance. Samtec Q-Strip interconnects are rated at up to 2,33 GHz while Q-Pairs interconnects are rated at up to 10 GHz.

New designs include right-angle and edge-mount for perpendicular and horizontal board mating in single-ended and differential pairs configurations. Miniature coax cable and shielded flex cable have been added. Board stacking space ranges have been expanded to include a variety of options from 5 mm to 30 mm in height.

Samtec also offers a number of high density solutions for achieving high speed interfaces, with designs on 1 mm or 1,27 mm pitch.

For more information contact Quentin van den Bergh, Arrow Altech Distribution, 011 923 9600, [email protected]



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