Samtec says its new Rise-Up high speed interconnect system (HSC8 Series) uses a controlled-impedance PCB with embedded ground plane for greatly improved performance over traditional connector sets. They are capable of transmitting data in excess of 6,25 Gbps and operate at up to 3,5 GHz/differential pair in 25 mm board stacking applications.
Connector interfaces (HSEC8/MEC8 Series) allow traditional parallel board stacking as well as perpendicular daughtercard type applications and horizontal or coplanar 'pizza box' applications. Depending on signal integrity requirements, various contact systems can be chosen for the best balance of performance and cost.
Off-the-shelf systems are available with single-ended (50 or 70 I/Os) differential pair (33 or 46 I/O pairs) routing and provide a 25 mm stack height. Application-specific boards for other stack heights as well as custom signal and power requirements are available.
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