Infineon Technologies has developed the next generation of its Goldmos LDMOS (laterally diffused metal-oxide semiconductor) die technology for high-performance, high-power RF transistors. In addition to superior linear efficiency, ultra-wide-bandwidth performance and reduced memory effect, Infineon says the new transistors provide the industry's best thermal performance. They are intended to be integrated into products designed for use in UMTS/WCDMA, GSM, CDMA, EDGE, TDSCDMA, PCS/DCS, MMDS, TV broadcast and DAB amplifiers. Gold metallisation has superior reliability at high temperatures. One of the first products is the single-ended, 2,1 GHz, 100 W PTFA211001E device. In 2-carrier WCDMA 3GPP mode, this device has an average output of 22 W and 16,5 dB gain with 30% efficiency. It has an ultra-wide-bandwidth of several hundred MHz, IM3 of -37 dBc and a thermal resistance of only 0,38°C/W. The company says that compared to its previous-generation Goldmos, the new range has a 30% increase in power density and higher terminal impedance.
Strategic agreement for eSIM solutions Avnet Silica
Telecoms, Datacoms, Wireless, IoT
This agreement between Avent Silica and Thales covers the latter’s eSIM solutions that are compliant with GSMA SGP.22 and SGP.32 standards.
Read more...High precision multi-GNSS antenna RS South Africa
Telecoms, Datacoms, Wireless, IoT
The Amphenol PCTEL GNSS-L125-DH-NF multi-GNSS antenna is a high-performance antenna designed for reliable global navigation satellite system reception in demanding environments.
Read more...Designing IoT devices for deterministic LPWAN environments
Editor's Choice Telecoms, Datacoms, Wireless, IoT
Built on Ultra Narrow Band communication technology, the Sigfox network focuses on low power, wide area M2M connectivity rather than maximising data throughput.
Read more...Robust LoRaWAN for distributed IoT
Telecoms, Datacoms, Wireless, IoT
InHand Networks has unveiled its latest LoRaWAN gateway, the EC312, marking an evolution in industrial-grade connectivity solutions for distributed IoT environments.
Read more...Miniaturised tuneable harmonic filter bank RFiber Solutions
Telecoms, Datacoms, Wireless, IoT
Modern RF and microwave communication systems require compact, high power filtering solutions to suppress unwanted harmonic signals generated by power amplifiers, and to address this challenge, Tri-TeQ has developed a miniaturised broadband tuneable harmonic switched filter bank.
Read more...Nordic accelerates cellular IoT leadership RF Design
Telecoms, Datacoms, Wireless, IoT
The company unveiled its next-generation portfolio featuring Cat 1 bis, satellite NTN, and advanced LTE-M/NB-IoT with edge AI, delivering secure and resilient connectivity across billions of IoT devices.
Read more...Powering the future of industrial automation IOT Electronics
Telecoms, Datacoms, Wireless, IoT
5G, the 5th generation of wireless broadband technology, enables users to establish reliable connectivity, which in turn enables flexible, autonomous, and efficient processes from production to logistics.
Read more...Wi-Fi 7 tri-band connectivity module iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Quectel has introduced the FCE870Q, a compact short range wireless connectivity module designed for next generation IoT devices that require high throughput, low latency, and reliable operation in dense wireless environments.
Read more...Compact cellular IoT SiP with GNSS RF Design
Telecoms, Datacoms, Wireless, IoT
Combining low-power connectivity, edge processing, and positioning capabilities in a compact module, Nordic’s nRF9151 targets applications such as asset tracking, smart metering, industrial monitoring, and smart city infrastructure.
Read more...Enabling the next generation of high-performance wireless designs iCorp Technologies
Telecoms, Datacoms, Wireless, IoT
Espressif Systems has expanded its wireless connectivity portfolio with the introduction of the ESP32-E22, a high-performance connectivity co-processor designed for next generation embedded and IoT systems.
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