Interconnection


BGA test socket

11 August 2004 Interconnection

Aries Electronics' test socket designed for the BGA version of the Intel Mobile Pentium III processor is a 495-lead 'BallNest' type that is designed to be surface-mounted directly onto the PCB pads of the customer's motherboard. The test socket features beryllium-copper contacts plated with 5,08 µm 90/10 tin/lead over nickel, and terminated in 90/10 lead/tin solderballs on the bottom side of the socket.

The insulator, lid, and base are fabricated from UL94V-0-rated FR-4 material.



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