8 September 2004Interconnection
Security Services & Risk Management
A line of high frequency test sockets, featuring an integrated heatsink for use with cavity-down quad flat packs (QFPs) has been introduced by Aries Electronics.
The RF Test Sockets have a top-sided heatsink that rests on the QFP's heat spreader to significantly increase heat dissipation away from the QFP device. Depending on application needs, the socket's heatsink can be furnished in aluminium or copper. The heatsink can be supplied with cooling fins or with a flat top surface for users who wish to add an additional heatsink.
The heatsink socket also features Aries' patented Microstrip Contacts that provide just 0,01 nH self-inductance per contact. The sockets also exhibit 10 GHz bandwidth at 1,0 dB at temperatures from -55 to +155°C. Typical life cycles for the contacts are 500 000 insertions/withdrawals with no loss of performance.
The sockets are available for QFPs, as well as other packages with top-sided heat spreaders, with up to 208 leads.
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