ON Semiconductor has introduced a comprehensive power solution comprised of 10 different devices that specifically meet the emerging Advanced Telecom Computing Architecture (AdvancedTCA) set down by the PCI Industrial Computer Manufacturers Group (PICMG).
The market for AdvancedTCA-based equipment is expected to exceed $15 billion in the next five years, according to Eric Mantion, senior analyst with In-Stat/MDR, as system designers seek to standardise non-proprietary subsystems or components in their systems (eg, power subsystems, memory boards). AdvancedTCA specifications provide a standards-based architecture for these subsystems in next generation carrier-grade communications equipment. The goal is to provide equipment users maximum 'up time' and to minimise cost-of-operation. System issues such as redundancy (no single-point-of-failure), hot swap and delivery of multiple point-of-load voltages in a single, size-constrained system environment create new power conversion and delivery challenges for AdvancedTCA system designers.
ON Semiconductor's power solution chipset addresses these key issues. It includes:
* High performance ORing diodes to enable ultra-fast switchover to redundant power supplies with greater efficiency than existing approaches.
* Hot swap ICs that deliver maximum protection against board failure when servicing online systems.
* A broad selection of DC-DC converters that enable designers to meet the evolving range of supply voltage needs of leading edge DSP, communications and processing building blocks.
The complete solution-set includes 10 devices:
* The NIS5101 SMART HotPlug (SPAK package) is a patented, highly integrated hot swap protection IC designed to enable the safe insertion and removal of electronic equipment to -48 V backplanes. Coupled with the NUD3048 FET Switch, these devices control the -48 V to 12 V isolated bus converter (TSOP6 package).
* The patented NIS6111 (PLLP package) ORing diode and NIS6201 (SO8 package) floating charge pump efficiently enable ORing of the two -48 V inputs. These devices deliver the function of a diode with the low forward voltage drop of a power MOSFET, enable ultra high-speed switching and allow the use of external MOSFETs for increased current handling capability.
* The NCP1561 push-pull/half-bridge controller is a highly integrated device (SOIC16 package) that incorporates all features required for high-density dc-dc conversion from the 48 V rail.
* The NCP5331 two-phase buck controller (LQFP32 package) is ideally suited for generating low voltage, high current output.
* The enhanced V2 control methodology, internal gate drivers, adjustable switching frequency of up to 600 kHz and 0,8% precision reference are a few features.
* The NCP5425 dual synchronous buck controller (TSSOP20 package) is a highly flexible device with internal gate drivers that can provide two independent outputs or one high current output. Has adjustable switching frequency up to 750 kHz and a +1% 0,8 V reference.
* The NTD60N02R, NTD30N02 and NTD85N02R MOSFETS (DPAK packages) offer high power efficiency and low RDS(on).
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