Passive Components


Small and stable ceramic capacitors replace tantalum

22 September 2004 Passive Components Integrated Solutions

During the past two years Yageo has developed ceramic capacitors with very thin dielectric layers and high capacitance. According to the company, newly-set-up production lines for these Phycomp-branded capacitors in The Netherlands and Taiwan guarantee sufficient volume to replace tantalum capacitors in many applications and enable customers to benefit from better electrical characteristics at lower cost.

The Phycomp capacitors show very low ESR and ESL, and this results in superior high frequency behaviour and very low heat dissipation. Compared to tantalum, benefits are: better overall performance; lower ESR and ESL; smaller size; higher reliability with regards to applied voltage; higher ripple current rating; higher Q-factor; smaller capacitance needed for the same application.

The Phycomp high capacitance multilayer ceramic capacitors are recommended for smoothing circuitry, decoupling and coupling circuitry. The family covers X5R, X7R and Y5V type capacitors. Capacitance values from 220 nF (0402) up to 100 μF (2220) are available in various package sizes and voltage ratings. Development is on-going - products expected in the near future are 1 μF in 0402, 100 μF in 1206 and 220 μF in 1812 as well as capacitors with upgraded voltage ratings.

For more information contact Ashley Sundraj, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Accelerate development of physical AI deployments
Altron Arrow DSP, Micros & Memory
With Avocado OS now available on the HummingBoard RZ-V2N- AIoT and SolidSense AIoT V2N from SolidRun, teams can move from prototype to deployed fleet in weeks.

Read more...
SMT flat-wire inductor for automotive electronics
Passive Components
Würth Elektronik introduces its new WE-SFIA series of flat-wire inductors in 2010, 2013, and 2016 packages.

Read more...
Nanocrystalline cores for cable assembly
Passive Components
Conventional MnZn and NiZn ferrite cores for cable assembly are now complemented by nanocrystalline cable cores.

Read more...
Universal NFC device
Altron Arrow DSP, Micros & Memory
Delivering high-end performance in a compact 4 x 4 mm package, the multipurpose NFC reader from ST Microelectronics, enables the convenience of contactless interaction and features for various end applications.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow AI & ML DSP, Micros & Memory
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Heat sinks for power-electronics and IC components
Passive Components
Würth Elektronik introduces heat sinks for power-electronics and IC components.

Read more...
SoC brings scalable edge AI to life
Altron Arrow AI & ML
The NXP i.MX 937 applications processor is optimised for performance without excessive power draw and bridges the gap between entry-level chips and high-end processors.

Read more...
Accelerate STM32-based IoT development with SPI EEPROM board
Altron Arrow Computer/Embedded Technology
ST Microelectronics’ ready-to-use STM32 expansion board helps design more efficient battery-friendly IoT devices based on ultra low power 32-Mbit Page.

Read more...
Compact direct Time-of-Flight 3D LiDAR module
Altron Arrow Opto-Electronics Electronics Technology AI & ML
The VL53L9 from STMicroelectronics is the first direct Time-of-Flight (dToF) 3D LiDAR all-in-one module in ST’s portfolio, offering a resolution of 2,3K zones, wide field of view, on-chip processing, 100 frames per second, and sensing range from 5 centimeters to 9 meters.

Read more...
Integrated layers offer dependable security
OPTEX SMART Security Solutions Technews Publishing Perimeter Security, Alarms & Intruder Detection Integrated Solutions
A layered approach to security tightens protection and minimises downtime and operational risk. Moreover, integrating all the parts of a solution and proving they can do the job before spending money are critical.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved