Hermaphroditic connectors help reduce costs and increase flexibility
22 September 2004Interconnection
Fire & Safety
Information Security
Integrated Solutions
Samtec offers three combination socket/terminal interface systems on 2,54, 2 and 0,635 mm pitch. These hermaphroditic connectors are self-mating, and therefore can reduce inventory costs by reducing the number of part numbers that must be stocked. All systems feature polarisation to prevent incorrect mating and audible 'clicks' to verify proper seating.
The 2,54 mm pitch system (LST Series) provides up to 60 I/Os and a board spacing of 13,60 mm. It features Samtec's Tiger Buy contacts. Application specific designs are available for other configurations and spacings.
On 2 mm pitch, a fully shrouded and keyed system (LS2 Series) provides up to 60 I/Os and a 9,65 mm board-to-board spacing. Right-angle designs are available for perpendicular and co-planar board mating. Application specific designs are available for other board spacings.
For micro pitch applications, a system on 0,635 mm pitch (LSS Series) provides full shrouding and board spacings from 6 mm to 12 mm and up to 100 I/Os.
For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, qvandenbergh@arrow.altech.co.za
Microchip expands its Arm Cortex-M0+ portfolio Altron Arrow
DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.
Read more...Security has an identity problem
Access Control & Identity Management Information Security
Cybersecurity discussions have mainly focused on defence, including stronger firewalls, tighter network controls, and better endpoint security. However, in today's world, those traditional defences have become less relevant.
Read more...Modernising ‘smart’ ports
IoT & Automation Information Security Transport (Industry) Logistics (Industry)
A modern port is part of a much larger digital trade ecosystem where all systems need to work together. If one part of that ecosystem is disrupted, the impact can quickly move through the supply chain.
Read more...More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
Read more...4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
Read more...56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
Read more...Space SMPM and SMPM-Lock connectors Hiconnex
Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...Samtec supports SGeT oHFM.c with high-performance interconnects Spectrum Concepts
Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version