Aries Electronics offers a new high frequency test socket for devices from 28 to 55 mm² wide. The socket is intended for use in manual testing of devices with pitches down to 0,50 mm, and in applications with speeds from 1 GHz to over 10 GHz, such as CSP, MicroBGA, DSP, LGA, SRAM, DRAM, and Flash devices.
The RF socket provides minimal signal loss for higher bandwidth capability via a signal path of only 1,95 mm. The 4-point spring probe crown on the socket ensures 'scrub' on solder ball oxides for reliable contact mating, and the pointed probe works with LGAs, MLFs and other socket types, says Aries. Single point probes are available for small land area contact pads.
The socket can be easily mounted to and removed from the test board, due to solderless, pressure-mount compression spring probes accurately located by two moulded plastic alignment pins and secured with four stainless steel screws. These gold over nickel compression spring probes leave very small witness marks on the bottom of the device solder balls. In addition, the socket's small overall size provides the maximum allowable space for load board components and connectors.
Estimated contact life is over 50 0000 cycles and contact self-inductance is 0,51 nH. Contact forces of the new centre probe sockets are 9 g to 12 g per contact for 0,50 mm to 0,75 mm pitches, and 17 g to 20 g per contact for 0,80 mm pitches and larger. Operating temperature is -55 to 150°C.
The compression spring probes are heat-treated beryllium copper alloy, plated with 0,75 μm gold over 0,75 μm nickel. The moulded components are UL94V-0 PEEK and/or Ultem. All hardware is stainless steel.
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