Circuit-over-packet processor family

3 November 2004 Telecoms, Datacoms, Wireless, IoT News Telecoms, Datacoms, Wireless, IoT

New low-density circuit emulation services (CES)-over-packet processors from Zarlink Semiconductors are claimed to be the industry's only end-to-end portfolio of circuit-to-packet devices. The three-chip ZL50120 family uses CES-over-packet technology to seamlessly tunnel up to four streams of TDM voice, video and data traffic with associated timing and signalling. The streams can be tunnelled across Ethernet, Internet protocol (IP) and multiprotocol label switching (MPLS) networks. Complementing the ZL50111 processors, the company's ZL50120 family delivers circuit-to-packet bridging devices that handle up to 32 streams of TDM traffic. The new ZL50120 series comprises: the ZL50118 chip supports a single T1/E1 stream, the ZL50119 device supports two T1/E1 streams and the ZL50120 chip supports four T1/E1 streams.

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