Intersil has announced a new family of line card access switches (LCAS) featuring latch up immunity, low power consumption and higher density for telephone communications equipment. The ISL5571, ISL5572 and ISL5573 are multiple relay replacement ICs for a broad range of voice-band communication products, including digital loop carrier and pairgain remote terminals, digital subscriber line (DSL) cards and Central Office and PABX switches.
These ICs are much smaller than electromechanical relays, and require less than 10% of the operating power, shrinking the space and power consumption of telecommunications systems, says Intersil. They use less than 10 mW when switches are activated, compared with up to 150 mW for an electro- mechanical relay coil. The trenched Bonded Wafer technology also results in immunity to latch-up for increased reliability making the devices effectively immune to surge conditions or incorrect power supply on the subscriber line that can destroy conventional ICs.
Intersil's LCAS devices also include secondary protection circuitry to divert hazardous voltages to ground and, together with the SLIC, protect the other line circuit electronics. The three Intersil devices include the ISL5571, a ringing access switch; the ISL5572, which is a ringing access switch with one test access switch; and the ISL5573, a ringing access switch with two test access switches.
Bounce-free switching also results in low impulse noise for mixed voice and high-speed data lines, lower bit error rates on connections, and non-degrading switch contacts during inductive load switching
Cost-effective microcontroller series Altron Arrow
DSP, Micros & Memory
The STM32C5 series from STMicroelectronics delivers an excellent balance of performance, efficiency, and affordability for embedded designs that require more capability without increasing bill of materials cost.
Read more...Understanding two key tools for cleaner serial data Altron Arrow
Editor's Choice Analogue, Mixed Signal, LSI
Understanding how pre-emphasis and equalisation works, and when to use one over the other, is critical when designing reliable high-speed systems.
Read more...Next-gen robotic systems initiative EBV Electrolink
Design Automation
EBV Elektronik recently introduced MOVE – Driving Robotics Forward, a new initiative designed by EBV Elektronik‘s Embedded Solutions team to support the development of next-generation robotic systems.
Read more...Compact high-current power inductor EBV Electrolink
Passive Components
Vishay’s IHLP series power inductors deliver high current capability in an ultra-low profile, magnetically shielded design.
Read more...Ultra-low jitter clocks Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Skyworks has introduced a new family of ultra-low jitter programmable clocks designed to meet the increasing demands of next-gen connectivity.
Read more...Efficient Bluetooth SoC Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The EFR32BG29 wireless SoC from Silicon Labs is a highly efficient, high memory, low-power, and ultra compact SoC designed for secure and high-performance wireless networking for IoT devices.
Read more...RTOS – The future of embedded systems Altron Arrow
Edge Computing & IIoT
At the heart of the next generation of embedded devices is efficient yet powerful system-level code, often based on an open-source real-time operating system.
Read more...Reference design for NB-IoT plus GNSS Altron Arrow
Design Automation
ST Microelectronics’ STDES-ST87M01IGN is a reference design for the ST87M01 NB-IoT + GNSS module, implemented on a 2-layer FR4 PCB (90 x 60 x 1,6 mm).
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.