Samtec's high speed flex circuit assembly offering now includes standard two-layer designs in a differential pair configuration on both 0,8 mm and 0,5 mm centrelines. These assemblies are an alternative for high speed, cost-sensitive applications for board-to-board distances of approximately 200 mm or less. Samtec's 0,8 mm pitch HFEM-DP Series in a 127 mm length, differential pair configuration will perform at 3,76 GHz per circuit at a -3 dB insertion loss.
Features of the high speed flex circuit assemblies include: choice of termination; single-ended; differential pair; choice of pitch; choice of 2- or 3-layer count; double sided, multilayer, and rigid flex; connector and component placement; easy customisation of cable lengths, pin counts, guide posts, connector heights etc.
For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]
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