Microchip Technology has converted its product packaging to environmentally friendly lead (Pb)-free plating, beginning January 2005. The company has selected matte tin (Sn) as its new plating material. This ensures that Microchip Pb-free products are backward compatible with industry-standard, tin/lead-based soldering processes, and forward compatible with higher-temperature Pb-free processes that are used with Pb-free pastes such as tin/silver/copper (SnAgCu).
The European Union 'Restrictions on Hazardous Substances' (RoHS) directive is scheduled to go into effect on 1 July, 2006. Microchip expects to phase out its inventory of tin/lead (SnPb)-plated products far in advance of the 2006 deadline.
For most of Microchip's packages in the new matte tin finish, sample availability and volume production are expected to begin in January 2005. Customers may receive SnPb or Pb-free material during 2005, while the existing inventory of SnPb-plated products is depleted and replaced with Pb-free material.
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