Telecoms, Datacoms, Wireless, IoT


Postage stamp-sized 'Smart' GSM platform

23 February 2005 Telecoms, Datacoms, Wireless, IoT

Claiming to have made good on its October 2003 promise, Freescale Semiconductor is sampling its Mobile Extreme Convergence architecture with Motorola, a leading handset manufacturer. The size of a postage stamp, Mobile Extreme Convergence (MXC) is designed to significantly reduce the materials and development effort required to deliver mid- and high-tier mobile devices. Designed to be inserted in an existing footprint, MXC allows developers to use a single platform to target multiple product designs currently delivered through as many as 300-400 components. This single platform could equip virtually any product - an MP3 player, a handheld DVD player, a digital camera - to become a fully functional smart mobile cellular device, says Freescale. The MXC275-30 platform, the first instantiation of the MXC architecture, is a comprehensive, integrated Single Core Modem GSM Edge solution.

See www.freescale.com/mxc.





Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Full sensor to cloud solution
CST Electronics Telecoms, Datacoms, Wireless, IoT
NeoCortec has demonstrated the seamless and rapid development of full sensor-to-cloud solutions using NeoMesh Click boards from MikroE and the IoTConnect cloud solution from Avnet.

Read more...
Long-range Wi-Fi HaLow module
TRX Electronics Telecoms, Datacoms, Wireless, IoT
One of Mouser’s newest products is the Morse Micro MM6108-MF08651-US Wi-Fi HaLow Module, which adheres to the IEEE 802.11ah standard.

Read more...
Quectel launches 3GPP NTN comms module
Quectel Wireless Solutions Telecoms, Datacoms, Wireless, IoT
Quectel Wireless Solutions has announced the Quectel BG95-S5 3GPP non-terrestrial network (NTN) satellite communication module.

Read more...
SIMCom’s A7673x series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat.1 bis module based on the ASR1606 chipset, that supports wireless communication modes of LTE-FDD, with a maximum downlink rate of 10 Mbps and a maximum uplink rate of 5 Mbps.

Read more...
Accelerating the commercialisation of the 5G IoT markets
Altron Arrow Editor's Choice Telecoms, Datacoms, Wireless, IoT
Fibocom unveils Non-Terrestrial Networks (NTN) module MA510-GL, enabling satellite and cellular connectivity to IoT applications.

Read more...
Long-range connectivity module
Avnet Silica Telecoms, Datacoms, Wireless, IoT
Digi XBee XR 868 RF Modules support the deployment of long-range connectivity applications, and support point-to-point and mesh networking protocols.

Read more...
4G LTE-M/NB-IoT connectivity reference design
iCorp Technologies Telecoms, Datacoms, Wireless, IoT
Developed around the industry-leading Nordic nRF9160 module, the platform comes complete with a newly-developed LTE antenna, ATRIA, which is pre-certified to operate over the full LTE-M and NB-IoT bands.

Read more...
Antennas to meet all connectivity requirements
Electrocomp Telecoms, Datacoms, Wireless, IoT
Kyocera AVX RF antennas meet today’s connectivity demands in the LTE, Wi-Fi, Bluetooth, GNSS, and ISM wireless bands, available in surface mount, patch or external configurations.

Read more...
Introducing SIMCom’s new A7673X series
Otto Wireless Solutions Telecoms, Datacoms, Wireless, IoT
SIMCom recently released the A7673X series, a Cat 1 bis module that supports LTE-FDD, with a maximum downlink rate of 10 Mbps and an uplink rate of 5 Mbps.

Read more...
18 W monolithic microwave amplifier
RFiber Solutions Telecoms, Datacoms, Wireless, IoT
The CHA8612-QDB is a two stage, high-power amplifier operating between 7,9 and 11 GHz. The monolithic microwave amplifier can typically provide 18 W of saturated output power and 40% of power-added efficiency.

Read more...