With the second variant of its AirMax VS backplane connector, FCI says system design engineers can reduce the number of layers in their high-speed backplanes and daughtercards by as much as 50% while improving the electrical performance of interconnections. Unique in its construction, the AirMax VS (virtual shield) connector uses an insert moulded leadframe assembly or 'IMLA' to carry both differential pair and single ended signals. Each signal path and each IMLA is separated by air, which eliminates the need for interleaving grounding shields. The use of air as a dielectric minimises both insertion loss and crosstalk.
Comprising 10 IMLA columns each equipped with 12 signal contacts, the latest AirMax VS vertical receptacle/right angle header connector configuration supports a reduced daughtercard slot spacing of 20 mm and offers a maximum of 40 differential pairs or 120 single ended connections. Compared to the previous 150-pin version, this 120-pin AirMax VS connector increases the air gap between the IMLAs from 2 mm to 3 mm, thereby allowing system designers to route high speed signals using only two layers of PCB backplanes and daughtercards. The consequent cost saving is accompanied by a further reduction in near-end multi-active crosstalk to less than 1,75% and far-end multi-active crosstalk to less than 2,25%, says the company.
In reference designs, the AirMax VS connector demonstrates superior signal integrity at speeds ranging from 2,5 Gbps to 6,25 Gbps, and allows users to scale systems to greater than 12 Gbps without requiring a basic platform redesign.
For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, [email protected]
RF agile transceiver Altron Arrow
Telecoms, Datacoms, Wireless, IoT
The AD9361 is a high performance, highly integrated RF Agile Transceiver designed for use in 3G and 4G base station applications.
Read more...Explosive zone connectors
Interconnection
The connector series design by Glenair is optimised for fast and easy crimp-contact wire termination, with ample wiring space in the cable housing and accessory hardware.
Read more...SmartRAID 4300 Series Altron Arrow
DSP, Micros & Memory
Microchip’s disaggregated architecture leverages host CPU and PCIe infrastructure to overcome traditional storage bottlenecks in scalable, secure NVMe RAID storage solutions.
Read more...The evolution of 4D imaging radar Altron Arrow
Telecoms, Datacoms, Wireless, IoT
4D imaging radar is redefining automotive sensing with unmatched precision, scalability and resilience and, as global adoption accelerates, this technology is poised to become a cornerstone of autonomous mobility.
Read more...Bluetooth wireless SoC Altron Arrow
Telecoms, Datacoms, Wireless, IoT
he EFR32BG29 wireless SoC from Silicon Labs is a highly efficient, high memory, low-power, and ultra compact SoC designed for secure and high-performance wireless networking for IoT devices.
Read more...Reliable photovoltaic adapter set Phoenix Contact
Interconnection
Phoenix Contact’s PV-AS-MC4/6-150-MN-SET1 is a high-performance photovoltaic adapter set designed to bridge SUNCLIX connectors with MC4 connectors.
Read more...Multi-config connector series Future Electronics
Interconnection
Hirose Electric’s DF11 Series is a versatile 2,0 mm pitch, double-row board-to-wire connector designed to simplify a wide range of connection needs.
Read more...Ultra-rugged connector Hiconnex
Interconnection
Radiall has introduced a new connector for ribbon fibre connections called Fortero to provide proven performance in high-vibration, high-impact, and extreme environments.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version