Interconnection


High-speed connector reduces layer count by 50%

9 March 2005 Interconnection

With the second variant of its AirMax VS backplane connector, FCI says system design engineers can reduce the number of layers in their high-speed backplanes and daughtercards by as much as 50% while improving the electrical performance of interconnections. Unique in its construction, the AirMax VS (virtual shield) connector uses an insert moulded leadframe assembly or 'IMLA' to carry both differential pair and single ended signals. Each signal path and each IMLA is separated by air, which eliminates the need for interleaving grounding shields. The use of air as a dielectric minimises both insertion loss and crosstalk.

Comprising 10 IMLA columns each equipped with 12 signal contacts, the latest AirMax VS vertical receptacle/right angle header connector configuration supports a reduced daughtercard slot spacing of 20 mm and offers a maximum of 40 differential pairs or 120 single ended connections. Compared to the previous 150-pin version, this 120-pin AirMax VS connector increases the air gap between the IMLAs from 2 mm to 3 mm, thereby allowing system designers to route high speed signals using only two layers of PCB backplanes and daughtercards. The consequent cost saving is accompanied by a further reduction in near-end multi-active crosstalk to less than 1,75% and far-end multi-active crosstalk to less than 2,25%, says the company.

In reference designs, the AirMax VS connector demonstrates superior signal integrity at speeds ranging from 2,5 Gbps to 6,25 Gbps, and allows users to scale systems to greater than 12 Gbps without requiring a basic platform redesign.

For more information contact Quentin van den Bergh, Arrow Altech Distribution, +27 (0)11 923 9600, qvandenbergh@arrow.altech.co.za



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

Interconnect system with 1,0 mm centreline
27 October 2021, TRX Electronics , Interconnection
Mouser Electronics is now stocking the AMPMODU 1,0 mm centreline interconnect system from TE Connectivity (TE). This interconnect system offers an 85% space saving on the board when compared to the ...

Read more...
SoM maker relies on ST MPU and open-source community
27 October 2021, Altron Arrow , Computer/Embedded Technology
“Open source is not only code sharing but a willingness to bring a certain know-how to a community and make a business around it.”

Read more...
Connector search spits out mated connector set in seconds
27 October 2021, Spectrum Concepts , Interconnection
Samtec has a multitude of ways to stack two or more boards together, thanks to a manufacturing process that allows it to position the plastic body on the terminal pin in increments of 0,13 mm on standard ...

Read more...
Multi-coax quick-turn microwave connectors
27 October 2021, Conical Technologies , Interconnection
Chinese RF and microwave connector, cable and adaptor manufacturer, Anoison, announced the release of the latest addition to its selection of RF and microwave products with the release of the PA-5 range ...

Read more...
Isolated SiC gate driver
27 October 2021, Altron Arrow , Power Electronics / Power Management
STMicroelectronics’ STGAP2SiCSN single-channel gate driver, optimised to control silicon carbide (SiC) MOSFETs, comes in a space-saving narrowbody SO-8 package and delivers robust performance with accurate ...

Read more...
Interconnect solutions for solar energy systems
27 October 2021, Hiconnex , Interconnection
Souriau is the chosen interconnect provider for some of the largest concentrated solar power (CSP) and photovoltaics (PV) projects in the world and is currently collaborating with new technology designs ...

Read more...
Analog microphone array board for advanced audio sensing
27 October 2021, Altron Arrow , Computer/Embedded Technology
The STEVAL-STWINMAV1 microphone array expansion board adds advanced audio sensing capabilities to STMicroelectronics’ STEVAL-STWINKT1B (and STEVAL-STWINKT1) SensorTile Wireless Industrial Node (STWIN) ...

Read more...
Terminal blocks with lateral push-in connection
27 October 2021, Phoenix Contact , Interconnection
The PTV terminal blocks with lateral conductor connection from Phoenix Contact ensure clear wiring without bending radii. As a result, it is also easier to affix and read the connection and conductor ...

Read more...
SDR transceiver delivers big advances in frequency hopping
27 October 2021, Altron Arrow , Telecoms, Datacoms, Wireless, IoT
The ADRV9002 empowers users with the frequency hopping capabilities to handle applications such as Link 16 and fast real-time carrier frequency loading in both single- and dual-channel operation modes.

Read more...
A UI to build better UIs
25 August 2021, Altron Arrow , Design Automation
TouchGFX Designer 4.17 has become available for download, the latest version of STMicroelectronics’ user interface (UI) design software featuring a user interface overhaul to make the application more ...

Read more...