FCI has extended its GIG-Array high-speed, high-density product line with the introduction of a new 13 mm plug connector.
The new GIG-Array mezzanine connectors provide either 200 or 296 signal contacts and add the capability for 18 mm or 28 mm board-to-board spacing when used in combination with the company's existing 5 mm or 15 mm receptacles. These stack heights expand upon the options for 15 mm, 20 mm, 25 mm, 30 mm and 35 mm spacing already available as part of the initial GIG-Array product range.
"We are offering equipment designers more stack-height options to enable them to address component clearance, airflow, or slot spacing requirements that are unique to their chassis designs. Blade server, communications, and networking equipment are among the applications that can benefit from the excellent high-speed electrical performance provided by GIG-Array connectors," said Grace Showers, FCI global product manager.
GIG-Array differential pairs nominally provide 100 Ω matched impedance to deliver higher speed performance with less reflected power. They can support transmission rates in the range of 10 Gbps.
The 296-position connector contains 37 columns with eight individual signal contacts and nine ground contacts in each column, while the 200-position connector contains 25 columns. The use of individual contacts for both signal and ground connections provides more flexibility in handling power or low-speed signals than systems that use interleaving ground shields.
All GIG-Array connectors feature FCI's innovative BGA connector termination for easy attachment to PCBs using conventional reflow soldering processes. The 1 x 0,65 mm BGA grid optimises routing and electrical performance.
Microchip expands its Arm Cortex-M0+ portfolio Altron Arrow
DSP, Micros & Memory
PIC32CM PL10 MCUs feature a rich set of Core Independent Peripherals, 5 V operation, touch capabilities, integrated toolsets, and safety compliance.
Read more...More room to scale Altron Arrow
Power Electronics / Power Management
With the latest STM32H5 lines from STMicroelectronics, you can now scale within the same platform, from a compact 1 Mbyte device to higher-memory MCUs for graphics-rich and feature-heavy designs.
Read more...4 mm pitch power connectors Spectrum Concepts
Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.
Read more...56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system
Read more...Space SMPM and SMPM-Lock connectors Hiconnex
Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.
Read more...Compact, high density, heavy duty, thermoplastic connectors TRX Electronics
Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.
Read more...Samtec supports SGeT oHFM.c with high-performance interconnects Spectrum Concepts
Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.
Read more...Multi-constellation GNSS module in a legacy-compatible footprint Altron Arrow
Telecoms, Datacoms, Wireless, IoT
Telit Cinterion has announced the SE869eK2L, a single-frequency L1 GNSS module designed to help device manufacturers upgrade legacy positioning designs with improved performance and cost efficiency, while preserving design continuity.
Read more...Compact SSI family for industrial automation Altron Arrow
Passive Components
Infineon Technologies has introduced the ISSI20BxxF Solid State Isolator (SSI) family, bringing solid-state isolation technology into high-volume applications traditionally served by photovoltaic isolators (PVIs), photovoltaic relays (PVRs), and electromechanical relays (EMRs).
Read more...Rev 2.0 PolarFire FPGA ethernet sensor bridge Altron Arrow
Computer/Embedded Technology
Smaller, multi-camera platform enables scalable Ethernet architectures for NVIDIA Edge AI systems, while lowering power, cost and integration complexity.
While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.
printer friendly version