Interconnection


I/O interface products

23 March 2005 Interconnection

Samtec has a large selection of modular jacks and D-subminiature connectors in its I/O interface product line. The DSM D-subs include vertical though-hole mount and discrete wire shells and contacts as well as terminals for crimp termination. These complement the D-sub line of standards, mini, and micro tail setbacks with though-hole and SMT configurations, right-angle and vertical orientations, and with a wide variety of mounting options and hardware including ground straps, threaded inserts, jack screws, and board locks.

The MODS and MODM Series of modular jacks include top entry, tab-up, and LED designs in both single and multiport ganged in-line and stacked configurations. They complement the existing line of mod jacks available in through-hole and SMT configurations, signal and multiport designs, and in a variety of interface styles with optional shielding.

Samtec also offers a full line of serial interfaces including USB, Firewire, mini-USB, and DVI interfaces.



Credit(s)



Share this article:
Share via emailShare via LinkedInPrint this page

Further reading:

4 mm pitch power connectors
Spectrum Concepts Interconnection
Mill-Max has introduced a new line of high-reliability, 4 mm (.157”) pitch sockets and headers designed for power connections and rugged field applications.

Read more...
56 G MezzaWave connectors and cable assemblies
Interconnection
Engineered to deliver notable signal integrity, TE Connectivity’s high-speed, high-density 56 G MezzaWave connector family is built on an open-pin-field array platform that supports data rates up to 56 Gbps PAM4 for next-generation modular system

Read more...
Space SMPM and SMPM-Lock connectors
Hiconnex Interconnection
Radiall has released the Space SMPM and SMPM-Lock, miniature Space connectors for high-frequency performance and high-density applications.

Read more...
Space saving SMD common-mode chokes
Electrocomp Passive Components
TDK Corporation presents the EP21 series of flat-wire double chokes designed for common-mode EMI filtering and available in an SMD format with dimensions of only 23,8 x 17,7 mm and heights ranging from 21,6 to 22,3 mm

Read more...
Compact, high density, heavy duty, thermoplastic connectors
TRX Electronics Interconnection
Amphenol Sine Systems ATD series connectors, available from Mouser, are a compact, high density, heavy duty, thermoplastic solution with superior environmental seals and end caps for exceptional rear seal retention.

Read more...
Samtec supports SGeT oHFM.c with high-performance interconnects
Spectrum Concepts Interconnection
Samtec has announced a new product portfolio designed for the SGeT oHFM.c standard. These connectors are based on Samtec’s proven AcceleRate HD and AcceleRate HP high-density, high-performance product families.

Read more...
Connectivity solutions for hydrogen technologies
Hiconnex Interconnection
As the production distribution and utilisation of hydrogen continue to scale, connectivity becomes a key enabler for efficient energy transmission, data communication, and system control.

Read more...
DC-link capacitors with ultra-low inductance
Electrocomp Passive Components
TDK Corporation recently released its new series of MKP DC high-frequency film capacitors, a high-performance DC link capacitor platform for next-generation SiC-based power electronics.

Read more...
Mixed-density Combo-D connectors
Hiconnex Interconnection
Positronic’s SCBM connector series is a rugged, high-performance family of mixed-density D-sub connectors engineered for demanding environments.

Read more...
Same Sky expands rectangular connector portfolio
Future Electronics Interconnection
The portfolio includes male pin headers, female pin headers, and box headers, giving engineers the flexibility to select the most appropriate connector style for their specific design requirements.

Read more...









While every effort has been made to ensure the accuracy of the information contained herein, the publisher and its agents cannot be held responsible for any errors contained, or any loss incurred as a result. Articles published do not necessarily reflect the views of the publishers. The editor reserves the right to alter or cut copy. Articles submitted are deemed to have been cleared for publication. Advertisements and company contact details are published as provided by the advertiser. Technews Publishing (Pty) Ltd cannot be held responsible for the accuracy or veracity of supplied material.




© Technews Publishing (Pty) Ltd | All Rights Reserved